公开(公告)号：US20230416480A1

公开(公告)日：2023-12-28

申请号：US18336050

申请日：2023-06-16

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-HUA LI ,  JIA-HAO WU

IPC: C08J5/18 ,  C08G73/10 ,  C08K3/04 ,  C08L79/08

CPC classification number: C08J5/18 ,  C08G73/1007 ,  C08G73/105 ,  C08G73/1071 ,  C08G73/1042 ,  C08J2379/08 ,  C08L79/08 ,  C08K2201/005 ,  C08L2205/12 ,  C08L2205/22 ,  C08K3/04

Abstract: A high-modulus black matte polyimide film is provided, the high-modulus black matte polyimide film includes polyimide in an amount from 75 to 93 wt % of the high-modulus matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide; carbon black in an amount from 2 to 8 wt % of the high-modulus matte polyimide film; and liquid crystal polymer micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 20 wt % of the high-modulus matte polyimide film, wherein the high-modulus matte polyimide film has a gloss value at 60° being less than 50.

公开(公告)号：US20220411594A1

公开(公告)日：2022-12-29

申请号：US17355204

申请日：2021-06-23

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： JIA-HAO WU ,  CHIA-YING CHOU ,  CHUN-YI CHENG

IPC: C08J5/18 ,  C08J7/04 ,  C08J3/11 ,  C08L33/24 ,  C08G73/10 ,  C08J3/24

Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

公开(公告)号：US20220339920A1

公开(公告)日：2022-10-27

申请号：US17725573

申请日：2022-04-21

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： JIA-HAO WU ,  TING-I LIU ,  MENG-YING TSAI

IPC: B32B27/28 ,  B32B27/08 ,  B32B27/32 ,  B32B15/08

Abstract: A polyimide composite film for use in a flexible metal clad substrate, comprising: a polyimide base material film; a fluorine polymer layer, formed on at least one surface of the polyimide base material film, comprising polyimide resins and fluorine polymers, wherein the polyimide resin accounts for 2 to 20 wt % of the total solid content of the fluorine polymer layer, the aromatic functional group ratio of the polyimide resin in the fluorine polymer layer is greater than 35%, and the absorption onset wavelength (λonset) of the ultraviolet-visible spectrum is greater than 360 nm; a thickness ratio of the polyimide base material film to one layer of the fluorine polymer layers is 8:1 to 1:4; and a total thickness of the polyimide composite film is between 18 and 175 microns. Thus, the polyimide composite film has a low dielectric constant, low loss factor, and has good drilling processability.