公开(公告)号：US20200377647A1

公开(公告)日：2020-12-03

申请号：US16496816

申请日：2018-03-13

Applicant: TDK CORPORATION

Inventor： Keiji ENOMOTO ,  Masaaki YAMASHITA ,  Hiroshi SHUTOH ,  Tsuyoshi SUGIYAMA ,  Tomoyuki HARAI ,  Yutaka SHIMIZU

IPC: C08G59/40 ,  C08L63/10 ,  C08K3/38 ,  C08K5/5313 ,  C08K5/13 ,  C08K5/18 ,  C08J5/18 ,  B32B27/38 ,  B32B27/26

Abstract: A resin composition including a main agent containing an epoxy compound, a curing agent, and inorganic particles, the curing agent includes an aromatic compound in which a ratio of the number of carbon atoms constituting an aromatic ring to a total number of carbon atoms in one molecule is 85% or more, a content of the inorganic particles is 40 to 75 vol % based on a total amount of components other than a solvent, the inorganic particles include boron nitride particles and particles different from the boron nitride particles, and a content of the boron nitride particles is 3 to 35 vol % based on a total amount of components other than a solvent.