公开(公告)号：US20150118498A1

公开(公告)日：2015-04-30

申请号：US14521709

申请日：2014-10-23

Applicant: TDK CORPORATION

Inventor： Tsuyoshi SUGIYAMA ,  Hiroshi SHUTOH

IPC: C08G59/62 ,  B32B27/38 ,  B32B37/15 ,  C08G59/50 ,  C08G59/32

CPC classification number: C08G59/621 ,  B32B27/38 ,  B32B37/15 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2457/00 ,  C08G59/5033 ,  C08G59/56 ,  C08K2003/2227 ,  Y10T428/31511

Abstract: The present invention provides a resin composition having a suitable melting temperature for molding, a resin sheet containing the resin composition, a cured resin product excellent in thermal conductivity and heat resistance, and a substrate. They are prepared in the way that in the resin composition containing epoxy compounds and curing agent selected from 1,3,5-tris(4-aminophenyl)benzene and 1,3,5-tris(4-hydroxyphenyl)benzene, the content of 1,3,5-triphenylbenzene that is the main skeleton of the curing agent is 15 mass % or more and 50 mass % or less of the total organic substances in the resin composition.

Abstract translation: 本发明提供了具有适合的成型熔融温度的树脂组合物，含有树脂组合物的树脂片，导热性和耐热性优异的固化树脂产品和基材。 它们的制备方式是在含有环氧化合物和选自1,3,5-三（4-氨基苯基）苯和1,3,5-三（4-羟基苯基）苯的固化剂的树脂组合物中，其含量 作为固化剂的主要骨架的1,3,5-三苯基苯是树脂组合物中总有机物质的15质量％以上且50质量％以下。

公开(公告)号：US20180105674A1

公开(公告)日：2018-04-19

申请号：US15561741

申请日：2016-04-28

Applicant: TDK CORPORATION

Inventor： Hiroshi SHUTOH ,  Masaaki YAMASHITA ,  Tsuyoshi SUGIYAMA

IPC: C08K5/13 ,  C08L63/00 ,  C08G59/62

CPC classification number: C08K5/13 ,  B32B27/38 ,  C07C39/15 ,  C08G59/62 ,  C08L63/00

Abstract: A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)×100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.

公开(公告)号：US20150329695A1

公开(公告)日：2015-11-19

申请号：US14708715

申请日：2015-05-11

Applicant: TDK CORPORATION

Inventor： Yutaka SHIMIZU ,  Tsuyoshi SUGIYAMA ,  Hiroshi SHUTOH ,  Masaaki YAMASHITA

IPC: C08K3/22 ,  C08K5/13 ,  C08K5/18

CPC classification number: C08K3/22 ,  C08K5/13 ,  C08K5/18 ,  C08K2003/222 ,  C08L63/00

Abstract: An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ΔRmax of −0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

Abstract translation: 含有无机填料的环氧树脂固化物含有氧化镁粉末，在300℃〜500℃的温度范围内具有-0.20质量％/℃以上的最大热重质量损失率＆Dgr; Rmax。 无机填料的环氧树脂固化物中的氧化镁粉末的填充率为45〜63体积％。

公开(公告)号：US20180112029A1

公开(公告)日：2018-04-26

申请号：US15561851

申请日：2016-04-28

Applicant: TDK CORPORATION

Inventor： Takayoshi KUWAJIMA ,  Tsuyoshi SUGIYAMA

IPC: C08G59/40 ,  C08K3/28 ,  C08K3/32 ,  C08K5/13 ,  C08K5/18 ,  C08L63/00

CPC classification number: C08G59/40 ,  C08G59/00 ,  C08G59/5033 ,  C08G59/621 ,  C08G65/00 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K3/28 ,  C08K3/32 ,  C08K5/13 ,  C08K5/18 ,  C08K2003/222 ,  C08K2003/282 ,  C08L63/00

Abstract: A resin composition includes an epoxy compound, a triphenylbenzene compound, an inorganic particle including a magnesium oxide (MgO) or the like, and phosphorus (P). The triphenylbenzene compound is a compound that includes 1,3,5-triphenylbenzene as a skeleton, and that includes a reactive group introduced in the skeleton. A content (mass %) of the phosphorus expressed by (mass of the phosphorus/mass of nonvolatile content excluding the inorganic particle)×100 is from 0.5 mass % to 4.3 mass %.

公开(公告)号：US20200377647A1

公开(公告)日：2020-12-03

申请号：US16496816

申请日：2018-03-13

Applicant: TDK CORPORATION

Inventor： Keiji ENOMOTO ,  Masaaki YAMASHITA ,  Hiroshi SHUTOH ,  Tsuyoshi SUGIYAMA ,  Tomoyuki HARAI ,  Yutaka SHIMIZU

IPC: C08G59/40 ,  C08L63/10 ,  C08K3/38 ,  C08K5/5313 ,  C08K5/13 ,  C08K5/18 ,  C08J5/18 ,  B32B27/38 ,  B32B27/26

Abstract: A resin composition including a main agent containing an epoxy compound, a curing agent, and inorganic particles, the curing agent includes an aromatic compound in which a ratio of the number of carbon atoms constituting an aromatic ring to a total number of carbon atoms in one molecule is 85% or more, a content of the inorganic particles is 40 to 75 vol % based on a total amount of components other than a solvent, the inorganic particles include boron nitride particles and particles different from the boron nitride particles, and a content of the boron nitride particles is 3 to 35 vol % based on a total amount of components other than a solvent.