公开(公告)号：US20230317366A1

公开(公告)日：2023-10-05

申请号：US18124236

申请日：2023-03-21

Applicant: TDK CORPORATION

Inventor： Takashi ITO ,  Tasuku KAWAGOE ,  Keigo HIGASHIDA

IPC: H01F27/40 ,  H01F27/29 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01F27/402 ,  H01F27/292 ,  H05K1/181 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10022

Abstract: The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.