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公开(公告)号：US12131062B2
公开(公告)日：2024-10-29
申请号：US17839896
申请日：2022-06-14
Applicant: Kioxia Corporation
Inventor： Fuminori Kimura
CPC classification number: G06F3/0658 , G06F3/0625 , G06F3/0679 , H05K1/147 , H05K1/141 , H05K1/181 , H05K1/182 , H05K2201/10015
Abstract: A memory system of an embodiment includes a memory, a controller configured to control the memory, and a first board on which the memory and the controller are mounted. The memory system further includes a module component including at least one capacitor, a second board, and a wiring member, each of the at least one capacitor including a lead, the at least one capacitor being mounted on the second board, the wiring member being electrically connected to the lead of the at least one capacitor and extending from the second board. The first board and the module component are connected to each other via the wiring member.
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公开(公告)号：US20240357734A1
公开(公告)日：2024-10-24
申请号：US18474880
申请日：2023-09-26
Applicant: Apple Inc.
Inventor： Behzad Biglarbegian , Hongrui Wang , Abbas Komijani , Reetika K Agarwal
CPC classification number: H05K1/0243 , H01P3/08 , H05K2201/10015 , H05K2201/1003 , H05K2201/10075
Abstract: An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.
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3.发明公开公开(公告)号：US20240282521A1
公开(公告)日：2024-08-22
申请号：US18526389
申请日：2023-12-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwi Dae KIM , Young Ghyu AHN
CPC classification number: H01G4/012 , H01G4/232 , H01G4/30 , H05K1/181 , H05K2201/10015
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The internal electrode is connected to the external electrode through a lead-out portion. With respect to a cross-section of the internal electrode in the second and third directions, when an average length of the lead-out portion in contact with the external electrode is defined as “A” and an average length of the external electrode, connected to the lead-out portion, in contact with the body is defined as “B,” “A/B” is 0.75 or less.
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公开(公告)号：US12062853B2
公开(公告)日：2024-08-13
申请号：US18313727
申请日：2023-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q1/246 , H01Q1/42 , H04B7/0413 , H05K1/181 , H05K9/0049 , H05K2201/042 , H05K2201/10015 , H05K2201/10098 , H05K2201/10719 , H05K2201/10734
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20240260197A1
公开(公告)日：2024-08-01
申请号：US18428062
申请日：2024-01-31
Applicant: IBIDEN CO., LTD.
Inventor： Nobuhisa KURODA , Tomoya DAIZO
IPC: H05K1/18 , H01L23/498 , H01L25/16 , H01L23/00
CPC classification number: H05K1/186 , H01L23/49838 , H01L25/16 , H01L24/13 , H01L24/16 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16227 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10159 , H05K2201/10977
Abstract: A wiring substrate includes a first insulating layer, a first conductive layer laminated on a surface of the first insulating layer and including pads, a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the first conductive layer and has a cavity exposing the pads of the first conductive layer, an electronic component accommodated in the cavity of the second insulating layer such that the electronic component has electrodes formed on a surface of the electronic component, and a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer.
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Patent Agency Ranking
公开(公告)号：US20240260167A1
公开(公告)日：2024-08-01
申请号：US18415119
申请日：2024-01-17
Applicant: CANON KABUSHIKI KAISHA
Inventor： KOJI NOGUCHI , MITSUTOSHI HASEGAWA , SATORU HIGUCHI
CPC classification number: H05K1/0201 , H01L23/49838 , H01R12/62 , H04N23/51 , H04N23/52 , H04N23/54 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/09854 , H05K2201/10015 , H05K2201/10022 , H05K2201/10068
Abstract: A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.
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公开(公告)号：US20240251502A1
公开(公告)日：2024-07-25
申请号：US18622921
申请日：2024-03-30
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor： Kazuma TANIMUKAI , Masaki KONO , Hirotaka DOI , Reiji KAWASHIMA , Yuki NAKAJIMA
CPC classification number: H05K1/0277 , H05K1/144 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/2009
Abstract: A substrate structure includes a first substrate with a plurality of chip parts including a first chip part mounted, and a second substrate connected to the first substrate. The first chip part has a strain equal to or more than a predetermined value, which is from 500 μST to 4000 μST, in a non-connected state in which the second substrate is not connected to the first substrate and the first substrate is supported at two predetermined points. The strain of the first chip part is equal to or less than the predetermined value in a connected state in which the second substrate is connected to the first substrate and the first substrate is supported at the two predetermined points.
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公开(公告)号：US20240244796A1
公开(公告)日：2024-07-18
申请号：US18559574
申请日：2022-06-14
Applicant: Mitsubishi Electric Corporation
Inventor： Yoshikazu TSUNODA , Takashi KUMAGAI , Tomohito FUKUDA , Yuji SHIRAKATA , Kenta FUJII
CPC classification number: H05K7/2039 , H05K1/18 , H05K7/20336 , H05K2201/10015
Abstract: A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.
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公开(公告)号：US20240244754A1
公开(公告)日：2024-07-18
申请号：US18559943
申请日：2022-06-14
Applicant: Mitsubishi Electric Corporation
Inventor： Yoshimichi SAITO , Yoshikazu TSUNODA , Kenta FUJII , Takashi KUMAGAI , Tomohito FUKUDA , Yuji SHIRAKATA
CPC classification number: H05K1/184 , H05K3/0085 , H05K2201/066 , H05K2201/095 , H05K2201/10015 , H05K2201/10409 , H05K2203/1147
Abstract: A circuit device includes: a heat sink having an upper surface orthogonal to a first direction; a plurality of first partition plates attached to the upper surface and extending in a second direction orthogonal to the first direction; a plurality of second partition plates attached to the upper surface and extending in a third direction orthogonal to the first direction and the second direction; a circuit component; a substrate electrically connected to the circuit component; and a first heat transfer member. The circuit component is housed in a space surrounded by two adjacent first partition plates, two adjacent second partition plates, and the upper surface. The first heat transfer member is disposed between the first partition plate and the circuit component.
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公开(公告)号：US20240237186A9
公开(公告)日：2024-07-11
申请号：US18313358
申请日：2023-05-07
Applicant: ELEMENTS PERFORMANCE TECHNOLOGY INC.
Inventor： JERRYSON LEE , Ethan Lee , Yu-Jia Huang , KUO-SUNG HUANG
CPC classification number: H05K1/0201 , F21V23/02 , H05K1/18 , F21Y2115/10 , H05K2201/062 , H05K2201/10015
Abstract: A power supply device having a thermal insulation function includes a circuit board, and at least one heat-sensitive component and a plurality of heat-generating electronic components that are disposed on the circuit board and spaced apart from one another. The heat-generating electronic components include a transformer, an inductor, an integrated circuit, or a metal oxide semiconductor (MOS). A minimum distance between the heat-sensitive component and the heat-generating electronic components is 7 mm. A thermal insulation area is defined between the heat-sensitive component and the heat-generating electronic components, and none of the heat-generating electronic components is disposed within a 270° range of the thermal insulation area. The heat-generating electronic components are disposed outside the thermal insulation area to separate the heat-sensitive component from a heat source on the circuit board, such that a high temperature of the heat source has less influence on the heat-sensitive component.
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