公开(公告)号：US20240062949A1

公开(公告)日：2024-02-22

申请号：US18366316

申请日：2023-08-07

Applicant: TDK Corporation

Inventor： Masaki ENDO ,  Tomonaga NISHIKAWA ,  Mitsuru MIURA ,  Eisuke YONEKURA ,  Akira MOTOHASHI

IPC: H01F27/29

CPC classification number: H01F27/292

Abstract: Disclosed herein is a coil component that includes a coil conductor embedded in the element body; a first bump conductor exposed to the mounting surface and the first and side surfaces; a second bump conductor exposed to the mounting surface and the second and fourth side surfaces; a first dummy bump conductor exposed to the mounting surface and the first and fourth side surfaces; a second dummy bump conductor exposed to the mounting surface and the second and third side surfaces; a first conductive resin layer connecting the first bump conductor and first dummy bump conductor; and a second conductive resin layer connecting the second bump conductor and the second dummy bump conductor. The first and bump conductors and the first and second dummy bump conductors are not covered at least partly with the first conductive resin layer.

公开(公告)号：US20240014112A1

公开(公告)日：2024-01-11

申请号：US18249862

申请日：2021-10-22

Applicant: TDK Corporation

Inventor： Kazutoshi TSUYUTANI ,  Tadashi MITO ,  Eisuke YONEKURA ,  Michitaka OKAZAKI ,  Masumi KAMEDA

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/14 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/142 ,  H01L21/4857

Abstract: An electronic component embedded substrate includes conductor layers L1 to L3, insulating layers 112 and 113 provided between the conductor layers L2 and L3, an insulating layer 114 provided between the conductor layers L1 and L2, a semiconductor embedded in the insulating layers 112 and 113, a via conductor 142 filling a via V, and a via conductor 143 filling a via 143a. The via 143a is provided at such a position that overlaps the via V and is shallower than the via V. The inner wall of the via 143a is larger in surface roughness than the inner wall of the via V. This makes voids less likely to occur in the via conductor 142 filling the deep via V and enhances adhesion between the via conductor 143 and the shallow via 143a that the via conductor 143 fills.