公开(公告)号：US20250014775A1

公开(公告)日：2025-01-09

申请号：US18897160

申请日：2024-09-26

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Keisuke NISHIOKA ,  Haruna OGAWA ,  Shinsuke HASHIMOTO

IPC: H01B1/22 ,  H01B17/64

Abstract: A conductive film including a film-like base material and a conductive layer provided on one main surface side of the base material is provided. The conductive layer includes a first metal layer containing a first metal and a second metal layer containing a second metal different from the first metal, provided in order from the base material side. The first metal layer includes grain boundaries.

公开(公告)号：US20250022629A1

公开(公告)日：2025-01-16

申请号：US18897309

申请日：2024-09-26

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Keisuke NISHIOKA ,  Haruna OGAWA ,  Shinsuke HASHIMOTO

IPC: H01B1/22 ,  H01B17/64

Abstract: A conductive film includes a base material 1, a first resin layer 10 provided on the base material 1, a second resin layer 20 provided on the first resin layer 10 and having a trench 25 opening to a surface opposite to the first resin layer 10, and a conductive layer 30 provided in the trench 25. The first resin layer 10 contains a first resin portion 12 and a plurality of first inorganic particles 11. At least a part of the plurality of first inorganic particles 11 partially protrude from the first resin portion 12 toward the second resin layer 20.

公开(公告)号：US20240349425A1

公开(公告)日：2024-10-17

申请号：US18683879

申请日：2022-08-17

Applicant: TDK CORPORATION

Inventor： Yoshihisa TAMAGAWA ,  Hiroshi SHINGAI ,  Daisuke SONODA ,  Keisuke NISHIOKA ,  Ken NODA

IPC: H05K1/09 ,  G02F1/1345 ,  H05K3/10

CPC classification number: H05K1/095 ,  H05K3/107 ,  G02F1/1345 ,  H05K2201/10136 ,  H05K2203/10

Abstract: An electrically conductive film including a film-like base material, and a resin layer and an electrically conductive part provided on a main surface of the base material is disclosed. The resin layer has a pattern including a linear trench. The electrically conductive part has a portion provided in the linear trench. The resin layer has raised portions formed along the trench on both sides of the linear trench and raised in the thickness direction of the resin layer.