公开(公告)号：US11443889B2

公开(公告)日：2022-09-13

申请号：US16903618

申请日：2020-06-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dushmantha Bandara Rajapaksha ,  Roland Sperlich ,  Anant Shankar Kamath ,  Vijayalakshmi Devarajan ,  Wesley Ray

IPC: H02M3/155 ,  H01F27/28 ,  H04L13/02 ,  H02M1/42

Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.

公开(公告)号：US11310072B2

公开(公告)日：2022-04-19

申请号：US17063450

申请日：2020-10-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Richard Sterling Broughton ,  Vijayalakshmi Devarajan ,  Wesley Ryan Ray ,  Dushmantha Bandara Rajapaksha

IPC: H04L12/40 ,  H04M3/02

Abstract: A transceiver includes a driver stage and a transient-triggered ring suppression circuit. The driver stage has a first transistor coupled between a supply voltage terminal and a first bus terminal and a second transistor coupled between a ground and a second bus terminal. The transient-triggered ring suppression circuit is coupled to the first and second transistors. The transient-triggered ring suppression circuit is configured to be enabled upon transition of the transceiver from a dominant state to a recessive state. Further, while the transceiver is in the recessive state, the transient-triggered ring suppression circuit is configured to attenuate ringing on at least one of the first or second bus terminals.

公开(公告)号：US11336331B2

公开(公告)日：2022-05-17

申请号：US17331984

申请日：2021-05-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dushmantha Bandara Rajapaksha ,  Wesley Ray ,  Hao Liu ,  Maxwell Robertson

IPC: H04B3/54 ,  H04L27/04 ,  H04L5/16 ,  H04B1/69 ,  H04L27/00 ,  H04L27/06

Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.

公开(公告)号：US20210159192A1

公开(公告)日：2021-05-27

申请号：US16697617

申请日：2019-11-27

Applicant: Texas Instruments Incorporated

Inventor： Dushmantha Bandara Rajapaksha ,  Vijayalakshmi Devarajan ,  Roland Sperlich ,  Wesley Ray

IPC: H01L23/62 ,  H01L23/31 ,  H01L23/495

Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

公开(公告)号：US12051978B2

公开(公告)日：2024-07-30

申请号：US17813366

申请日：2022-07-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dushmantha Bandara Rajapaksha ,  Roland Sperlich ,  Anant Shankar Kamath ,  Vijayalakshmi Devarajan ,  Wesley Ray

IPC: H02M3/335 ,  H01F27/28 ,  H02M1/42 ,  H02M3/155 ,  H04L13/02 ,  H02M3/00

CPC classification number: H02M3/33523 ,  H01F27/288 ,  H02M1/4258 ,  H02M3/155 ,  H02M3/33569 ,  H02M3/33573 ,  H04L13/02 ,  H02M3/01

Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.

公开(公告)号：US11380631B2

公开(公告)日：2022-07-05

申请号：US16697617

申请日：2019-11-27

Applicant: Texas Instruments Incorporated

Inventor： Dushmantha Bandara Rajapaksha ,  Vijayalakshmi Devarajan ,  Roland Sperlich ,  Wesley Ray

IPC: H01L23/62 ,  H01L23/31 ,  H01L23/495

Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

公开(公告)号：US11050460B2

公开(公告)日：2021-06-29

申请号：US16438165

申请日：2019-06-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dushmantha Bandara Rajapaksha ,  Wesley Ray ,  Hao Liu ,  Maxwell Robertson

IPC: H04B3/54 ,  H04L27/04 ,  H04L5/16 ,  H04L27/00 ,  H04L27/06 ,  H04B1/69

Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.