公开(公告)号：US20220122936A1

公开(公告)日：2022-04-21

申请号：US17219681

申请日：2021-03-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory WILLIAMSON ,  Hiep Xuan NGUYEN

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.

公开(公告)号：US20220319954A1

公开(公告)日：2022-10-06

申请号：US17219602

申请日：2021-03-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory WILLIAMSON ,  Rongwei ZHANG

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31

Abstract: In examples, a semiconductor package comprises a substrate including a conductive layer; a conductive pillar coupled to the conductive layer; and a semiconductor die having first and second opposing surfaces. The first surface is coupled to the conductive pillar. The package also includes a die attach film abutting the second surface of the semiconductor die and a metal layer abutting the die attach film and having a metal layer surface facing away from the die attach film. The metal layer surface is exposed to an exterior of the FCCSP. The package includes a mold compound layer covering the substrate.