公开(公告)号：US20220122936A1

公开(公告)日：2022-04-21

申请号：US17219681

申请日：2021-03-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory WILLIAMSON ,  Hiep Xuan NGUYEN

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.

公开(公告)号：US20220208662A1

公开(公告)日：2022-06-30

申请号：US17139571

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin ZHANG ,  Yi YAN ,  Hiep Xuan NGUYEN

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L23/64 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.