公开(公告)号：US20250079401A1

公开(公告)日：2025-03-06

申请号：US18459075

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei ZHANG ,  Thomas KRONENBERG ,  Jie CHEN

IPC: H01L25/065 ,  H01L21/3065 ,  H01L21/56 ,  H01L21/822 ,  H01L23/00 ,  H01L23/31 ,  H01L23/60

Abstract: In examples, a package comprises first and second dies including first and second diodes, respectively. The package comprises first and second metal contacts coupled to bottom surfaces of the first and second dies, respectively, with the first and second metal contacts exposed to a bottom surface of the package. The package also comprises an isolation layer between the first and second dies and between the first and second metal contacts and a metal layer coupled to top surfaces of the first and second dies. The package also comprises a mold compound covering the first and second dies and the metal layer.

公开(公告)号：US20220319954A1

公开(公告)日：2022-10-06

申请号：US17219602

申请日：2021-03-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory WILLIAMSON ,  Rongwei ZHANG

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31

Abstract: In examples, a semiconductor package comprises a substrate including a conductive layer; a conductive pillar coupled to the conductive layer; and a semiconductor die having first and second opposing surfaces. The first surface is coupled to the conductive pillar. The package also includes a die attach film abutting the second surface of the semiconductor die and a metal layer abutting the die attach film and having a metal layer surface facing away from the die attach film. The metal layer surface is exposed to an exterior of the FCCSP. The package includes a mold compound layer covering the substrate.