公开(公告)号：US20250069976A1

公开(公告)日：2025-02-27

申请号：US18455163

申请日：2023-08-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vernon BUCK ,  Katleen Fajardo TIMBOL ,  Jeffrey SOLAS

IPC: H01L23/31 ,  G01N27/22 ,  H01L21/56 ,  H01L23/00 ,  H01L23/24

Abstract: An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die and a ring is disposed on the die and encircles the sensor. The ring includes a cylindrical wall and a cap, where the cylindrical wall has an open top and the cap has a partial circular shape that extends beyond each side of the cylindrical wall, A cover is disposed on the cap such that the cover closes off the open top of the ring to form a cavity inside the ring to prevent foreign substance from entering the cavity. A mold compound covers the die and the cover, and abuts an outer surface of the cylindrical wall.

公开(公告)号：US20240248058A1

公开(公告)日：2024-07-25

申请号：US18159244

申请日：2023-01-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christlyn Faith ARIAS ,  Jeffrey SOLAS

IPC: G01N27/22 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: G01N27/223 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/4952 ,  H01L23/562 ,  H01L23/564

Abstract: A semiconductor device includes a semiconductor die having a surface and sensing circuitry at a sensing region of the surface. A tubular wall of a metal material has an inner sidewall around the sensing region to provide a sensing cavity that extends from the surface of the semiconductor die to an opening at a distal edge thereof. The tubular wall includes a proximal portion and a distal flange portion. The proximal portion extends longitudinally from the surface. The distal flange portion extends radially outwardly from the proximal portion a first distance and radially inwardly from the proximal portion a second distance that is less than the first distance.

公开(公告)号：US20250020610A1

公开(公告)日：2025-01-16

申请号：US18902134

申请日：2024-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christlyn Faith ARIAS ,  Jeffrey SOLAS

IPC: G01N27/22 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a semiconductor die having a surface and sensing circuitry at a sensing region of the surface. A tubular wall of a metal material has an inner sidewall around the sensing region to provide a sensing cavity that extends from the surface of the semiconductor die to an opening at a distal edge thereof. The tubular wall includes a proximal portion and a distal flange portion. The proximal portion extends longitudinally from the surface. The distal flange portion extends radially outwardly from the proximal portion a first distance and radially inwardly from the proximal portion a second distance that is less than the first distance.