公开(公告)号：US20220352055A1

公开(公告)日：2022-11-03

申请号：US17246056

申请日：2021-04-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Makoto SHIBUYA ,  Makoto YOSHINO ,  Kengo AOYA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/49 ,  H01L21/48 ,  H01L21/56

Abstract: In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.

公开(公告)号：US20240379509A1

公开(公告)日：2024-11-14

申请号：US18781062

申请日：2024-07-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Makoto SHIBUYA ,  Makoto YOSHINO ,  Kengo AOYA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49

Abstract: In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.