公开(公告)号：US11430719B2

公开(公告)日：2022-08-30

申请号：US16455583

申请日：2019-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Manu A. Prakuzhy ,  Siva P. Gurrum ,  Daryl R. Heussner ,  Stefan W. Wiktor ,  Ken Pham

IPC: H01L23/495 ,  H01L23/31 ,  H02M3/158

Abstract: A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.

公开(公告)号：US20190318983A1

公开(公告)日：2019-10-17

申请号：US16455583

申请日：2019-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Manu A. Prakuzhy ,  Siva P. Gurrum ,  Daryl R. Heussner ,  Stefan W. Wiktor ,  Ken Pham

IPC: H01L23/495 ,  H02M3/158 ,  H01L23/31

Abstract: A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.