公开(公告)号：US20240120297A1

公开(公告)日：2024-04-11

申请号：US17958254

申请日：2022-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jie Chen ,  Rajen Maricon Murugan ,  Chittranjan Mohan Gupta ,  Yiqi Tang

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6677

Abstract: An apparatus includes: a first conductor layer patterned into parallel strips having a first end and an opposite second end formed on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers extending through the dielectric material; a second conductor layer in the multilayer package substrate spaced from the first conductor layer, the second conductor layer patterned into parallel strips having a first end and a second end, the second conductor layer coupled to the first conductor layer by vertical connectors formed of the conductive vertical connection layers at the first end and the second end, and a semiconductor die mounted to the device side surface of the multilayer package substrate that is spaced from and coupled to the second conductor.