公开(公告)号：US20240243024A1

公开(公告)日：2024-07-18

申请号：US18618843

申请日：2024-03-27

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred KummerlL ,  Wai Lee

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/29 ,  H01L25/065

CPC分类号： H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

摘要： In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.