公开(公告)号：US12203776B2

公开(公告)日：2025-01-21

申请号：US16950981

申请日：2020-11-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Christopher Daniel Manack ,  Leslie Edward Stark

IPC: G01D11/24 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.

公开(公告)号：US20240243024A1

公开(公告)日：2024-07-18

申请号：US18618843

申请日：2024-03-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred KummerlL ,  Wai Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US09899339B2

公开(公告)日：2018-02-20

申请号：US13668901

申请日：2012-11-05

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/60 ,  H01L23/64 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/64 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L24/24 ,  H01L24/29 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24265 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/73217 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82102 ,  H01L2224/822 ,  H01L2224/8221 ,  H01L2224/82399 ,  H01L2224/8284 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2224/8312 ,  H01L2924/00

Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

公开(公告)号：US11972994B2

公开(公告)日：2024-04-30

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred Kummerl ,  Wai Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US11658083B2

公开(公告)日：2023-05-23

申请号：US17116963

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred Kummerl ,  Wai Lee

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/14 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20140361402A1

公开(公告)日：2014-12-11

申请号：US14468370

申请日：2014-08-26

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/28

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

公开(公告)号：US20140175599A1

公开(公告)日：2014-06-26

申请号：US13723874

申请日：2012-12-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L49/02

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。

公开(公告)号：US11894339B2

公开(公告)日：2024-02-06

申请号：US17121198

申请日：2020-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark

IPC: H01L25/04 ,  H01L25/075 ,  G01S17/08 ,  H01L33/62

CPC classification number: H01L25/042 ,  G01S17/08 ,  H01L25/0753 ,  H01L33/62

Abstract: A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.

公开(公告)号：US11476175B2

公开(公告)日：2022-10-18

申请号：US17125487

申请日：2020-12-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/29

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

公开(公告)号：US08847349B2

公开(公告)日：2014-09-30

申请号：US13723874

申请日：2012-12-21

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Screenivasan K. Koduri

IPC: H01L29/00 ,  H01L49/02

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。