公开(公告)号：US20190206785A1

公开(公告)日：2019-07-04

申请号：US15898694

申请日：2018-02-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ricky Alan JACKSON ,  Ting-TA YEN ,  Brian E. GOODLIN

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/58 ,  H01L23/532 ,  H01L25/07

CPC classification number: H01L23/49866 ,  H01L23/49838 ,  H01L23/53238 ,  H01L23/562 ,  H01L23/585 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L25/074

Abstract: An electronic device comprises: a molybdenum layer; a bond pad formed on the molybdenum layer, the bond pad comprising aluminum; and a wire bonded to the bond pad, the wire comprising gold.