公开(公告)号：US20190256976A1

公开(公告)日：2019-08-22

申请号：US16243007

申请日：2019-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takumi KABE ,  Michitaka AITA

IPC: C23C16/455

Abstract: A gas distribution device includes a plurality of supply lines, a branch unit and a variation suppression unit. The supply lines are respectively connected to a plurality of processing chambers. The branch unit is configured to distribute a gas supplied from a gas supply source to the supply lines. The variation suppression unit is provided between the branch unit and the gas supply source and configured to supply the gas from the gas supply source to the branch unit and suppress variation in flow rates of the gas distributed by the branch unit between the supply lines.

公开(公告)号：US20230238219A1

公开(公告)日：2023-07-27

申请号：US18008008

申请日：2021-03-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Eiki KAMATA ,  Taro IKEDA ,  Satoru KAWAKAMI ,  Takumi KABE

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32458 ,  H01J37/32532 ,  H01J2237/334

Abstract: This plasma processing apparatus for performing plasma processing on an end part of a substrate includes a processing container, a substrate supporting member configured to support a portion of the substrate and to which a high frequency power is applied, at least a side of the substrate supporting member being composed of a dielectric, an opposing dielectric member composed of a dielectric and disposed to oppose the substrate supporting member, and a gas supply configured to supply a processing gas for generating plasma on at least the end part of the substrate. The plasma processing apparatus further includes a side ground electrode provided at a side of the substrate so as to be close to the substrate to such an extent that an electrical coupling is formed between an end surface of the substrate and the side ground electrode, the side ground electrode having a ground potential.