公开(公告)号：US20180037983A1

公开(公告)日：2018-02-08

申请号：US15554841

申请日：2016-03-07

Applicant: TOPCON CORPORATION

Inventor： Masahiro AKIBA ,  Yoshihiro YAMAGUCHI ,  Makoto SETA

IPC: C23C14/34 ,  H01J37/34 ,  H01L21/677 ,  C23C14/54 ,  C23C14/50

CPC classification number: C23C14/34 ,  C23C14/083 ,  C23C14/10 ,  C23C14/50 ,  C23C14/505 ,  C23C14/548 ,  C23C14/568 ,  G11B7/265 ,  H01J37/3414 ,  H01J37/3447 ,  H01L21/67201 ,  H01L21/677 ,  H01L21/68764 ,  H01L21/68771

Abstract: A sputtering device capable of satisfying various requirements is provided. The sputtering device includes a rotation and revolution table, multiple sputtering targets, an RF plasma source, and a load-lock chamber 102. The rotation and revolution table is arranged inside a pressure-reducible container 101 and is rotatable by independent control. The multiple sputtering targets are arranged on a revolution orbit of the rotation and revolution table so as to correspond to multiple workpieces 107 to be set on the rotation and revolution table. The RF plasma source performs plasma treatment. The load-lock chamber 102 is used for setting the multiple workpieces on the rotation and revolution table. The rotation and revolution table is configured by arranging multiple rotation mounts 105 on a revolution table 104, and the rotations of the revolution table 104 and the multiple rotation mounts 105 are independently controllable.