公开(公告)号：US20240017919A1

公开(公告)日：2024-01-18

申请号：US18221805

申请日：2023-07-13

Applicant: SEMES CO., LTD.

Inventor： Seul LEE

IPC: B65G1/04 ,  B66F9/07 ,  H01L21/677

CPC classification number: B65G1/0407 ,  B66F9/07 ,  H01L21/677

Abstract: A stocker system having an active shelf module capable of accommodating a plurality of carriers and a control method thereof are provided. The stocker system may include a stocker body having at least one accommodation space therein; an active shelf module installed on the stocker body and having at least a portion extended or retracted in a forward and reverse direction; and a controller configured to extend the active shelf module to receive a carrier from the outside of the stocker body and control the active shelf module to accommodate the carrier in the accommodation space inside the stocker body.

公开(公告)号：US11784073B2

公开(公告)日：2023-10-10

申请号：US17686278

申请日：2022-03-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Yang-Ann Chu ,  Alan Yang ,  Vic Huang ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/677 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67772 ,  H01L21/681 ,  H01L21/683

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

公开(公告)号：US20230207347A1

公开(公告)日：2023-06-29

申请号：US18146699

申请日：2022-12-27

Applicant: SEMES CO, LTD.

Inventor： Jaeil HYUN ,  Gihong PARK ,  Jaesung JU ,  Jooyoung LEE

IPC: H01L21/67 ,  H01L21/027 ,  H01L21/677 ,  G03F7/20

CPC classification number: H01L21/67109 ,  H01L21/027 ,  H01L21/677 ,  G03F7/70875

Abstract: An apparatus for processing a substrate may include a heating plate configured to heat a substrate placed thereon, a cooling conveyor including a conveyor configured to transfer a heated substrate, and a first cooling part configured to cool the heated substrate while transferring the heated substrate on the conveyor and configured to provide a cooling atmosphere relative to the heated substrate over the conveyor, and a transfer part configured to transfer the heated substrate from the heating plate onto the conveyor.

公开(公告)号：US20190204144A1

公开(公告)日：2019-07-04

申请号：US16296880

申请日：2019-03-08

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Mamoru OISHI ,  Yasuhiro MATSUDA ,  Masaya NISHIDA

IPC: G01H11/06 ,  G01N29/12 ,  G06F9/30 ,  H01L21/67

CPC classification number: G01H11/06 ,  G01N29/12 ,  G06F9/3004 ,  H01L21/02 ,  H01L21/67092 ,  H01L21/677 ,  H01L2021/607

Abstract: A substrate processing apparatus includes: a placement part whereon a substrate container is placed; a substrate retainer supporting the substrate; transfer mechanisms configured to transfer the substrate between the substrate container and the substrate retainer and to perform a transfer operation; a detector provided at one or more of the transfer mechanisms to detect vibration; a memory device that registers, in advance, natural frequencies of the substrate and one or more of the transfer mechanisms and threshold values of the substrate and the plurality of transfer mechanisms; and a monitoring part to monitor whether an intensity of the vibration, based on transformed data obtained by transforming detection data, exceeds at least one of the threshold values of the substrate and the plurality of transfer mechanisms and whether a vibration frequency is equal to at least one of the natural frequencies of the substrate and the plurality of transfer mechanisms.

公开(公告)号：US20180366320A1

公开(公告)日：2018-12-20

申请号：US15921919

申请日：2018-03-15

Applicant: AU Optronics Corporation

Inventor： Yi-Cheng LIU ,  Chin-Yuan Ho

IPC: H01L21/02 ,  H01L21/677 ,  G09G3/32

CPC classification number: H01L21/02104 ,  G09G3/32 ,  H01L21/677 ,  H01L33/0095 ,  H01L33/62 ,  H01L2933/0066

Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

公开(公告)号：US20180358252A1

公开(公告)日：2018-12-13

申请号：US15780685

申请日：2016-10-13

Applicant: MURATA MACHINERY, LTD.

Inventor： Osamu HONDA ,  Keiji YAMADA ,  Takashi NOZAWA ,  Daisuke ONO

IPC: H01L21/677 ,  B65G43/10

CPC classification number: H01L21/67736 ,  B65G43/10 ,  H01L21/677 ,  H01L21/67724 ,  H01L21/67733 ,  H01L21/67769

Abstract: A conveyance system includes a track, ceiling conveyance vehicles, and a conveyance controller configured or programmed to output a conveyance instruction for a FOUP to the ceiling conveyance vehicles. When a first FOUP on a downstream port is waiting for collection the conveyance controller waits without outputting a conveyance instruction instructing collection of the first FOUP until any of the conveyance vehicles conveying a second FOUP to an upstream port has been recognized until a waiting time set in advance has elapsed since the first FOUP changed to the state waiting for collection and outputs the conveyance instruction instructing collection of the first FOUP when the waiting time has elapsed since a point in time when the first FOUP changed to the state waiting for collection.

公开(公告)号：US20180350646A1

公开(公告)日：2018-12-06

申请号：US15780680

申请日：2016-10-13

Applicant: MURATA MACHINERY, LTD.

Inventor： Osamu HONDA ,  Keiji YAMADA ,  Daisuke ONO ,  Takashi NOZAWA

IPC: H01L21/677

CPC classification number: H01L21/67754 ,  B65G1/00 ,  B65G43/00 ,  H01L21/677 ,  H01L21/67724 ,  H01L21/67763

Abstract: A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.

公开(公告)号：US20180342407A1

公开(公告)日：2018-11-29

申请号：US15551289

申请日：2017-06-20

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Lixuan Chen

IPC: H01L21/677 ,  H01L33/00 ,  H01L33/40 ,  H01L33/62 ,  B41J2/16

CPC classification number: H01L21/677 ,  B41J2/1631 ,  H01L33/005 ,  H01L33/40 ,  H01L33/62

Abstract: The present invention provides a micro transfer printing method, which uses pick-up projections provided on a transfer head to suck and hold micro components arranged on a carrier plate, followed by reversing the transfer head and the carrier plate to make the transfer head positioned under the carrier plate, and then separates the transfer head and the carrier plate from each other to allow the micro components that are sucked and held by the pick-up projections to be carried by and supported on the transfer head, and then moves the transfer head that carries thereon the micro components to a location above a receiving substrate and turning the transfer head up side down to allow the micro components that are held on the pick-up projections to be positioned on the receiving substrate. In the micro transfer printing method of the present invention, during the course that the transfer head transfers the micro components, the micro components are carried by and supported on the transfer head and compared to the prior art, holding the micro components on the transfer head does not require any means to overcome influence caused by the gravity so as to ensure stable and smooth transfer of the micro components by the transfer head to thereby allowing for fast movement of the transfer head and thus effectively increasing transfer rate and speed of the transfer head.

公开(公告)号：US20180308731A1

公开(公告)日：2018-10-25

申请号：US15738027

申请日：2016-06-08

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Haruki TAKEUCHI

IPC: H01L21/673 ,  H01L21/677 ,  A61L2/20

CPC classification number: H01L21/67373 ,  A61L2/20 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/677 ,  H01L21/67772

Abstract: Reliability in the restriction of the movement of a container is improved.A content moving device 1 includes: a table portion 20 on which a container 50 is placed; and a restricting mechanism 30. A flange 55 of the container 50 is shaped to provide a recessed portion 56a. A restricting mechanism 30 includes: a collar portion 31; a first restricting portion 32 configured to be located in the recessed portion 56a; a second restricting portion 33a provided above the first restricting portion 32 and inward of the collar portion 31; and a second moving mechanism. The second moving mechanism is configured to move the second restricting portion 33a along an extending direction B between a first position, in which the second restricting portion 33a is opposed to the flange 55 of the container 50 in an up-down direction A, and a second position, in which the second restricting portion 33a is opposed to the recessed portion 56a in the up-down direction A without being opposed to the flange 55 in the up-down direction A.

公开(公告)号：US20180254210A1

公开(公告)日：2018-09-06

申请号：US15518092

申请日：2014-10-10

Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA

Inventor： Takayuki FUKUSHIMA ,  Ryosuke KANAMARU

IPC: H01L21/677 ,  H01L21/687 ,  B25J15/00 ,  B25J9/16

CPC classification number: H01L21/67718 ,  B25J9/1664 ,  B25J15/00 ,  H01L21/677 ,  H01L21/67778 ,  H01L21/68707

Abstract: A wafer transfer method which transfers a wafer with a disc shape to a groove for vertically placing the wafer therein, by use of a wafer holding hand, includes causing the wafer holding hand to hold the wafer at at least three support points on an edge of the wafer; moving the wafer holding hand holding the wafer to cause the wafer with a vertical posture in which the wafer is vertically oriented to be positioned above the groove for vertically placing the wafer therein; causing the wafer holding hand to cease to hold the wafer and to support the wafer at two support points on the wedge of the wafer; and moving the wafer holding hand supporting the wafer downward until the edge of the wafer moves into the groove for vertically placing the wafer therein.