公开(公告)号：US20230047411A1

公开(公告)日：2023-02-16

申请号：US17975763

申请日：2022-10-28

Applicant: TOPPAN Inc.

Inventor： Hiroaki KAWADA ,  Kenzo FUKUYOSHI

IPC: G02B5/20 ,  H01L33/60 ,  H01L33/50 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: A black matrix substrate assembly including a transparent substrate, a black matrix pattern, a transparent resin layer, a resin wall pattern, a light reflective layer, and a transparent protective layer. The black matrix pattern includes first and second black linear segments with a width Ax of each first segment in a first direction. The resin wall pattern includes first and second wall linear segments with a width Dx of each first segment smaller than the width Ax in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment. The light reflective layer includes first and second reflective linear segments with a width Cx of each first segment larger than the width Dx in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment.