公开(公告)号：US09267057B2

公开(公告)日：2016-02-23

申请号：US14060131

申请日：2013-10-22

Applicant: Taimide Technology Incorporation

Inventor： Chung-Yi Chen ,  Chih-Wei Lin ,  Chi-Huan Lo ,  Shihan Tai

IPC: B32B5/16 ,  C09D179/08 ,  C08G73/10 ,  C08L79/08 ,  C08K13/02 ,  C08J5/18

CPC classification number: C09D179/08 ,  C08G73/10 ,  C08J5/18 ,  C08J2379/08 ,  C08J2479/08 ,  C08K13/02 ,  C08L79/08 ,  Y10T428/31721

Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.

Abstract translation: 聚酰亚胺膜包括聚酰亚胺基层聚酰亚胺层和分散在聚酰亚胺基聚合物中的聚酰亚胺粉末，该聚酰亚胺粉末是通过二胺与二酸酐的摩尔比为约1:0.950至约1:0.995 。 此外，聚酰亚胺膜可以具有至少包含层叠在聚酰亚胺层的表面上的第二聚酰亚胺层的多层结构。 第二聚酰亚胺还可以包含聚酰亚胺粉末，其重量比小于第二聚酰亚胺层的总重量的约20重量％。 本文所述的实施方案还包括制备聚酰亚胺膜的方法。