公开(公告)号：US12129338B2

公开(公告)日：2024-10-29

申请号：US16957345

申请日：2019-04-09

Applicant: LG CHEM, LTD.

Inventor： Changbo Shim ,  Seunghyun Song ,  Hwayeon Moon ,  Hyunsung Min ,  Hee Yong Shim

IPC: C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/68 ,  C08J5/24 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03

CPC classification number: C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/686 ,  C08J5/244 ,  C08J5/249 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/145 ,  H01L23/562 ,  H05K1/0271 ,  H05K1/0373 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/14 ,  C08J2363/00 ,  C08J2433/08 ,  C08J2479/08 ,  C08K2201/003 ,  C08K2201/014 ,  C08L2205/025 ,  C08L2205/035 ,  H05K2201/068

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

公开(公告)号：US11898056B2

公开(公告)日：2024-02-13

申请号：US16892531

申请日：2020-06-04

Applicant: Ensinger GmbH

Inventor： Michael Möller

IPC: C09D177/06 ,  C08J7/04 ,  C08J7/044 ,  C09D5/24 ,  C09D177/02 ,  C09D177/10 ,  B05D1/06 ,  B05D3/00 ,  B05D7/02 ,  C08J7/043 ,  C08J7/048

CPC classification number: C09D177/06 ,  B05D1/06 ,  B05D3/005 ,  B05D7/02 ,  C08J7/043 ,  C08J7/044 ,  C08J7/048 ,  C08J7/0427 ,  C09D5/24 ,  C09D177/02 ,  C09D177/10 ,  C08J2379/08 ,  C08J2479/08

Abstract: A polymer-based substrate is proposed, which in particular is electrostatically coatable, wherein the substrate comprises a substrate base body made using a polymeric material and a coating applied to a surface region of the substrate base body, wherein the polymeric material comprises a first polymer, wherein the coating comprises a matrix polymer and an additive which is dispersed in the matrix polymer and reduces the surface resistance of the coating, said additive having a proportion that is selected such that the specific surface resistance of the coating is about 1010 Ohm or less, and wherein the matrix polymer is selected such that it is compatible with the first polymer.

公开(公告)号：US20230415095A1

公开(公告)日：2023-12-28

申请号：US18463214

申请日：2023-09-07

Applicant: UOP LLC

Inventor： Chunqing Liu ,  Xueliang Dong ,  Jeremy Webb

IPC: B01D53/22 ,  B01D71/64 ,  B01D71/68 ,  B01D69/02 ,  B01D69/08 ,  B01D69/12 ,  B01D67/00 ,  C08J5/18 ,  C10L3/10 ,  B01D61/36

CPC classification number: B01D53/228 ,  B01D71/64 ,  B01D71/68 ,  B01D69/02 ,  B01D69/087 ,  B01D69/125 ,  B01D69/085 ,  B01D67/0095 ,  B01D67/0083 ,  B01D67/0088 ,  B01D67/009 ,  C08J5/18 ,  C10L3/104 ,  C10L3/103 ,  B01D61/362 ,  C08J2381/06 ,  B01D2053/224 ,  B01D2323/30 ,  B01D2323/22 ,  B01D2325/022 ,  B01D2325/20 ,  C10L2290/548 ,  C08J2379/08 ,  C08J2481/06 ,  C08J2479/08

Abstract: A low cost, high selectivity asymmetric polyimide/polyethersulfone (PES) blend hollow fiber membrane, a method of making the membrane and its use for a variety of liquid, gas, and vapor separations such as deep desulfurization of gasoline and diesel fuels, ethanol/water separations, pervaporation dehydration of aqueous/organic mixtures, CO2/CH4, CO2/N2, H2/CH4, He/CH4, O2/N2, H2S/CH4, olefin/paraffin, iso/normal paraffins separations, and other light gas mixture separations. The polyimide/PES blend hollow fiber membrane is fabricated from a blend of a polyimide polymer and PES and showed surprisingly unique gas separation property with higher selectivities than either the polyimide hollow fiber membrane without PES polymer or the PES hollow fiber membrane without PES polymer for gas separations such as for H2/CH4, He/CH4, H2S/CH4, CO2/CH4 separations.

公开(公告)号：US11786861B2

公开(公告)日：2023-10-17

申请号：US17121384

申请日：2020-12-14

Applicant: UOP LLC

Inventor： Chunqing Liu ,  Xueliang Dong ,  Jeremy Nolan Webb

IPC: B01D53/22 ,  B01D71/64 ,  B01D71/68 ,  B01D69/02 ,  B01D69/08 ,  B01D69/12 ,  B01D67/00 ,  C08J5/18 ,  C10L3/10 ,  B01D61/36

CPC classification number: B01D53/228 ,  B01D61/362 ,  B01D67/009 ,  B01D67/0083 ,  B01D67/0088 ,  B01D67/0095 ,  B01D69/02 ,  B01D69/085 ,  B01D69/087 ,  B01D69/125 ,  B01D71/64 ,  B01D71/68 ,  C08J5/18 ,  C10L3/103 ,  C10L3/104 ,  B01D2053/224 ,  B01D2323/22 ,  B01D2323/30 ,  B01D2325/022 ,  B01D2325/20 ,  C08J2379/08 ,  C08J2381/06 ,  C08J2479/08 ,  C08J2481/06 ,  C10L2290/548

Abstract: A low cost, high selectivity asymmetric polyimide/polyethersulfone (PES) blend hollow fiber membrane, a method of making the membrane and its use for a variety of liquid, gas, and vapor separations such as deep desulfurization of gasoline and diesel fuels, ethanol/water separations, pervaporation dehydration of aqueous/organic mixtures, CO2/CH4, CO2/N2, H2/CH4, He/CH4, O2/N2, H2S/CH4, olefin/paraffin, iso/normal paraffins separations, and other light gas mixture separations. The polyimide/PES blend hollow fiber membrane is fabricated from a blend of a polyimide polymer and PES and showed surprisingly unique gas separation property with higher selectivities than either the polyimide hollow fiber membrane without PES polymer or the PES hollow fiber membrane without PES polymer for gas separations such as for H2/CH4, He/CH4, H2S/CH4, CO2/CH4 separations.

公开(公告)号：US11700687B2

公开(公告)日：2023-07-11

申请号：US16899504

申请日：2020-06-11

Applicant: DUPONT ELECTRONICS, INC.

Inventor： Joseph Casey Johnson ,  Delanie J Losey ,  Peggy Scott ,  Christopher Dennis Simone

IPC: H05K1/03 ,  B32B15/08 ,  B32B27/28 ,  C08L79/08

CPC classification number: H05K1/036 ,  B32B15/08 ,  B32B27/281 ,  H05K1/0393 ,  C08J2479/08 ,  C08L79/08 ,  H05K2201/0154 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

公开(公告)号：US11647583B2

公开(公告)日：2023-05-09

申请号：US16095120

申请日：2017-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shimpei Obata ,  Ryuuji Takahashi ,  Yasunori Hoshino ,  Shigetoshi Fujita

IPC: H05K1/03 ,  B32B15/08 ,  B32B5/28 ,  C08J5/10 ,  C08J5/24 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/08 ,  C08J5/10 ,  C08J5/244 ,  H01L23/49894 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2457/08 ,  C08J2361/06 ,  C08J2361/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2425/12 ,  C08J2433/00 ,  C08J2433/04 ,  C08J2433/12 ,  C08J2433/20 ,  C08J2461/06 ,  C08J2461/08 ,  C08J2463/00 ,  C08J2475/00 ,  C08J2479/08 ,  C08J2483/04 ,  H05K2201/0218 ,  H05K2201/0227

Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.

公开(公告)号：US20180327552A1

公开(公告)日：2018-11-15

申请号：US16032969

申请日：2018-07-11

Applicant: Arevo, Inc.

Inventor： Riley Reese ,  Hemant Bheda

IPC: C08J3/22 ,  B33Y70/00

CPC classification number: C08J3/226 ,  B33Y70/00 ,  C08J2379/08 ,  C08J2381/06 ,  C08J2479/08 ,  C08J2481/06

Abstract: Methods for producing 3D printing composite polymer materials for use in additive manufacturing processes are provided. The methods result in enhancing the material properties of the printing material by providing a uniform and smooth surface finish of the printing material and the nozzle extrudate for additive manufacturing processes, such as Fused Filament Fabrication. The method includes implementing impregnation techniques for combining carbon nanotubes or other nano-fillers, a polymer resin and a fiber material to produce a polymer material that can be processed into a printing material. Further, the method may include combining the carbon nanotubes or other nano-fillers and the polymer resin to form a masterbatch that may be further combined with the fiber material through an extrusion process. The method results in a printing material with enhanced material properties and smooth surface finish for the printing material and resulting nozzle extrudate for Fused Filament Fabrication.

公开(公告)号：US20180265655A1

公开(公告)日：2018-09-20

申请号：US15544483

申请日：2015-10-01

Applicant: Mark SANNER ,  Neal PFEIFFENBERGER ,  Matthew F. NIEMEYER ,  SABIC GLOBAL TECHNOLOGIES, B.V.

Inventor： Mark SANNER ,  Neal PFEIFFENBERGER ,  Matthew F. NIEMEYER

IPC: C08J5/18 ,  H01G4/18 ,  H01G4/008

CPC classification number: C08J5/18 ,  B32B7/00 ,  B32B7/12 ,  B32B15/00 ,  B32B15/04 ,  B32B15/08 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/28 ,  B32B27/281 ,  B32B27/36 ,  B32B2307/20 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/516 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2457/16 ,  C08G73/1017 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1071 ,  C08J2367/02 ,  C08J2379/08 ,  C08J2467/02 ,  C08J2479/08 ,  C08L79/08 ,  H01G4/008 ,  H01G4/18 ,  C08L67/02

Abstract: A uniaxially-stretched, high yield extruded capacitor film comprising a miscible polymer blend comprising a polyetherimide and a polyester, wherein the polyetherimide comprises units derived from polymerization of an aromatic dianhydride with a diamine comprising a m-phenylenediamine, a p-phenylenediamine, or combinations thereof, wherein the polyetherimide is endcapped with a substituted or unsubstituted aromatic primary monoamine, wherein the polyester comprises repeating structural units derived from polymerization of an aromatic dicarboxylic acid with a dihydroxy compound, and wherein the high yield extruded capacitor film comprises equal to or greater than about 90 wt. % of the miscible polymer blend entering an extruder used for manufacturing the capacitor film, based on the total weight of miscible polymer blend prior to entering the extruder.

公开(公告)号：US10077337B2

公开(公告)日：2018-09-18

申请号：US14901089

申请日：2014-06-26

Applicant: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.

Inventor： Akira Mori ,  Aiko Hara ,  Eigo Kondo ,  Tomonori Ando

IPC: C08G73/10 ,  C09D179/08 ,  C08J7/04 ,  B32B27/28 ,  B32B15/08 ,  H05K1/03

CPC classification number: C08G73/1082 ,  B32B15/08 ,  B32B27/281 ,  B32B2457/00 ,  C08G73/1042 ,  C08G73/105 ,  C08J7/047 ,  C08J2379/08 ,  C08J2479/08 ,  C09D179/08 ,  H05K1/036 ,  H05K2201/0108 ,  H05K2201/0154

Abstract: A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10−6 to 30×10−6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.

公开(公告)号：US20180148555A1

公开(公告)日：2018-05-31

申请号：US15572390

申请日：2016-12-28

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Yong Seon HWANG ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM ,  Young Chan KIM ,  Seung Hyun SONG ,  Won Ki KIM

IPC: C08J5/24 ,  C08L65/02 ,  H01L23/14 ,  H01L23/00

CPC classification number: C08J5/24 ,  C08G2261/135 ,  C08G2261/1414 ,  C08G2261/142 ,  C08G2261/143 ,  C08G2261/3424 ,  C08G2261/76 ,  C08J2365/02 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2479/08 ,  C08K9/06 ,  C08L33/08 ,  C08L33/24 ,  C08L61/14 ,  C08L63/00 ,  C08L65/02 ,  H01L23/145 ,  H01L23/29 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/562 ,  C08L61/34 ,  C08L79/085

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.