公开(公告)号：US20240385388A1

公开(公告)日：2024-11-21

申请号：US18319854

申请日：2023-05-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Szu-Wei Lu ,  Tsung-Fu Tsai ,  Chao-Jen Wang

IPC: G02B6/38 ,  G02B6/40

Abstract: Devices and methods of manufacture and use of a fiber bundle is presented. In embodiments the fiber bundle comprises a substrate material and optical fiber openings that extend from a first side of the substrate material to a second side of the substrate material, wherein the optical fiber openings at the first side of the substrate material are shifted either horizontally or vertically from the second side of the substrate material.

公开(公告)号：US20240280764A1

公开(公告)日：2024-08-22

申请号：US18364332

申请日：2023-08-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Chen-Hua Yu ,  Szu-Wei Lu ,  Chao-Jen Wang

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  G02B6/4239 ,  G02B6/4245

Abstract: A method includes connecting a photonic package to a substrate, wherein the photonic package includes a waveguide and an edge coupler that is optically coupled to the waveguide; connecting a semiconductor device to the substrate adjacent the photonic package; depositing a first protection material on a first sidewall of the photonic package that is adjacent the edge coupler; encapsulating the photonic package and the semiconductor device with an encapsulant; performing a first sawing process through the encapsulant and the substrate, wherein the first sawing process exposes the first protection material; and removing the first protection material to expose the first sidewall of the photonic package.

公开(公告)号：US20250076594A1

公开(公告)日：2025-03-06

申请号：US18543459

申请日：2023-12-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tung-Liang Shao ,  Yi-Jan Lin ,  Yu-Sheng Huang ,  Tsung-Fu Tsai ,  Chao-Jen Wang ,  Szu-Wei Lu

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/13

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

公开(公告)号：US20250044517A1

公开(公告)日：2025-02-06

申请号：US18365050

申请日：2023-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chao-Jen Wang ,  Szu-Wei Lu ,  Tsung-Fu Tsai ,  Chen-Hua Yu

IPC: G02B6/30 ,  G02B6/32

Abstract: A package includes an optical engine attached to a package substrate, wherein the optical engine includes a first waveguide; and a waveguide structure attached to the package substrate adjacent the optical engine, wherein the waveguide structure includes a second waveguide within a transparent block, wherein a first end of the second waveguide is optically coupled to the first waveguide, wherein the waveguide structure is configured to be connected to an optical fiber component such that a second end of the second waveguide is optically coupled to an optical fiber of the optical fiber component.