公开(公告)号：US20240393533A1

公开(公告)日：2024-11-28

申请号：US18323523

申请日：2023-05-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Chen-Hua Yu

IPC: G02B6/122 ,  G02B6/13

Abstract: A device is provided that includes: a photonic integrated circuit; a laser die comprising a welding pad; and a first optical fiber including: a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of the photonic integrated circuit; and a second end of the first optical fiber fused to the welding pad, wherein a second fusion bond exists between the second end of the first optical cable and the welding pad.

公开(公告)号：US20250123440A1

公开(公告)日：2025-04-17

申请号：US18431187

申请日：2024-02-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tung-Liang Shao ,  Yu-Sheng Huang

IPC: G02B6/12 ,  G02B6/13

Abstract: A package includes an interposer; a photonic interconnect structure connected to the interposer, wherein the photonic interconnect structure includes: photonic components; waveguides that are optically coupled to the photonic components; and an electronic die that is electrically coupled to the photonic components; and dies electrically connected to the interposer, wherein the dies are electrically coupled to the photonic interconnect structure through the interposer.

公开(公告)号：US12272616B2

公开(公告)日：2025-04-08

申请号：US17701468

申请日：2022-03-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tung-Liang Shao ,  Yu-Sheng Huang ,  Shih-Chang Ku ,  Chuei-Tang Wang

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L25/10 ,  H01L21/56 ,  H01L25/18 ,  H01L27/12

Abstract: Packaged semiconductor devices including heat-dissipating structures and methods of forming the same are disclosed. In an embodiment, a semiconductor package includes a semiconductor die including a substrate, a front-side interconnect structure on a front-side of the substrate, and a backside interconnect structure on a backside of the substrate opposite the front-side interconnect structure; a support die disposed on the front-side interconnect structure; a heat-dissipating structure on the support die, the heat-dissipating structure being thermally coupled to the semiconductor die and the support die; a redistribution structure on the backside interconnect structure opposite the substrate, the redistribution structure being electrically coupled to the semiconductor die; and an encapsulant on the redistribution structure and adjacent to side surfaces of the semiconductor die, the support die, and the heat-dissipating structure.

公开(公告)号：US20250123449A1

公开(公告)日：2025-04-17

申请号：US18415784

申请日：2024-01-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Chen-Hua Yu

IPC: G02B6/42

Abstract: A package includes an interposer, wherein the interposer includes a first waveguide and a first reflector that is optically coupled to the first waveguide; an optical package attached to the interposer, wherein the optical package includes a second waveguide; and a second reflector that is optically coupled to the second waveguide, wherein the second reflector is vertically aligned with the first reflector.

公开(公告)号：US20250076594A1

公开(公告)日：2025-03-06

申请号：US18543459

申请日：2023-12-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tung-Liang Shao ,  Yi-Jan Lin ,  Yu-Sheng Huang ,  Tsung-Fu Tsai ,  Chao-Jen Wang ,  Szu-Wei Lu

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/13

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

公开(公告)号：US20250044532A1

公开(公告)日：2025-02-06

申请号：US18352655

申请日：2023-08-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Chen-Hua Yu

IPC: G02B6/42

Abstract: A package includes an optical engine attached to a package substrate, wherein the optical engine includes a first waveguide; and a waveguide structure attached to the package substrate adjacent the optical engine, wherein the waveguide structure includes a second waveguide within a transparent block, wherein a bottom surface of the transparent block is nonplanar, wherein the second waveguide is a fixed distance from the bottom surface along its length, wherein the second waveguide is optically coupled to the first waveguide.

公开(公告)号：US20240063079A1

公开(公告)日：2024-02-22

申请号：US17891218

申请日：2022-08-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Kuo Yang Wu ,  Chen-Hua Yu

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/44 ,  H01L23/373 ,  H01L25/065

CPC classification number: H01L23/3675 ,  H01L24/32 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/73 ,  H01L23/49838 ,  H01L21/4882 ,  H01L23/3677 ,  H01L23/44 ,  H01L23/3735 ,  H01L24/08 ,  H01L25/0655 ,  H01L24/29 ,  H01L2224/08235 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/3511 ,  H01L2924/182 ,  H01L2924/16196 ,  H01L2924/16235 ,  H01L2924/1632 ,  H01L2924/16587 ,  H01L2224/29187

Abstract: In an embodiment, a package is provided. The package includes a semiconductor device; an encapsulant laterally surrounding the semiconductor device; and a heat dissipation structure disposed over the semiconductor device and the encapsulant, wherein the heat dissipation structure includes a plurality of pillars and a porous layer extending over sidewalls of the plurality of pillars.

公开(公告)号：US20230187307A1

公开(公告)日：2023-06-15

申请号：US17701468

申请日：2022-03-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tung-Liang Shao ,  Yu-Sheng Huang ,  Shih-Chang Ku ,  Chuei-Tang Wang

IPC: H01L23/373 ,  H01L25/10 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/3735 ,  H01L25/105 ,  H01L23/367 ,  H01L23/3128 ,  H01L24/83 ,  H01L24/29 ,  H01L2224/29186 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/32145 ,  H01L24/20 ,  H01L2224/2101 ,  H01L2225/1035 ,  H01L2225/1094 ,  H01L2225/1058 ,  H01L25/18

Abstract: Packaged semiconductor devices including heat-dissipating structures and methods of forming the same are disclosed. In an embodiment, a semiconductor package includes a semiconductor die including a substrate, a front-side interconnect structure on a front-side of the substrate, and a backside interconnect structure on a backside of the substrate opposite the front-side interconnect structure; a support die disposed on the front-side interconnect structure; a heat-dissipating structure on the support die, the heat-dissipating structure being thermally coupled to the semiconductor die and the support die; a redistribution structure on the backside interconnect structure opposite the substrate, the redistribution structure being electrically coupled to the semiconductor die; and an encapsulant on the redistribution structure and adjacent to side surfaces of the semiconductor die, the support die, and the heat-dissipating structure.

公开(公告)号：US20240393549A1

公开(公告)日：2024-11-28

申请号：US18324544

申请日：2023-05-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Tsung-Fu Tsai ,  Chen-Hua Yu

IPC: G02B6/42

Abstract: Optical devices and methods of manufacture are presented in which an optical device and other devices such as laser dies are attached prior to bonding of the optical device and laser die to other device. The optical device and laser die are separated by no more than about 10 μm.

公开(公告)号：US20240272389A1

公开(公告)日：2024-08-15

申请号：US18323534

申请日：2023-05-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Chen-Hua Yu

IPC: G02B6/42

CPC classification number: G02B6/428 ,  G02B6/4214 ,  G02B6/4243 ,  G02B6/4238

Abstract: A method includes forming an optical engine including a photonic integrated circuit die, wherein the photonic integrated circuit die includes an optical component, forming an adapter comprising a laser written waveguide, and assembling the optical engine, the adapter, and an optical fiber as a package. The optical fiber is optically coupled to the optical component through the laser written waveguide in the adapter.