公开(公告)号：US20230290694A1

公开(公告)日：2023-09-14

申请号：US17693439

申请日：2022-03-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tse-Pan Yang ,  Wei Lee ,  Kuo-Pei Lu ,  Jen-Yuan Chang

IPC分类号： H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L49/02 ,  G01R31/28

CPC分类号： H01L22/30 ,  H01L23/481 ,  H01L23/49822 ,  H01L28/20 ,  G01R31/2884

摘要： A test key configured to measure resistance of a through semiconductor via in a semiconductor substrate is provided. The test key includes a first resistor, a first conductor, a first probe pad, a second conductor, a second probe pad, a third conductor, a third probe pad, a fourth conductor, and a fourth probe pad. The first probe pad is electrically connected to a first end of the through semiconductor via by the first resistor and the first conductor. The second probe pad is electrically connected to the first end of the through semiconductor via by the second conductor. The third probe pad is electrically connected to a second end of the through semiconductor via by the third conductor. The fourth probe pad is electrically connected to the second end of the through semiconductor via by the fourth conductor.