公开(公告)号：US20200321677A1

公开(公告)日：2020-10-08

申请号：US16716642

申请日：2019-12-17

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Stassen Cook ,  Vikas Gupta ,  Athena Lin ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01P3/12 ,  H01Q1/22 ,  H04B1/40

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.

公开(公告)号：US10910705B2

公开(公告)日：2021-02-02

申请号：US16447419

申请日：2019-06-20

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Athena Lin ,  Juan Alejandro Herbsommer

IPC: H01Q1/38 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498 ,  H01L21/48 ,  H01L23/14 ,  H01L23/15 ,  H01L21/56 ,  H01Q1/22 ,  H04B1/40 ,  H01Q1/24

Abstract: An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

公开(公告)号：US11128023B2

公开(公告)日：2021-09-21

申请号：US16716642

申请日：2019-12-17

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Stassen Cook ,  Vikas Gupta ,  Athena Lin ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q1/22 ,  H04B1/40 ,  H01P3/12

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.