公开(公告)号：US20230061423A1

公开(公告)日：2023-03-02

申请号：US17820076

申请日：2022-08-16

Applicant: Tokyo Electron Limited

Inventor： Junnosuke TAGUCHI ,  Yasutomo KIMURA ,  Hisashi TAKAHASHI

IPC: H01L21/687 ,  C23C14/50

Abstract: A substrate processing apparatus includes a processing chamber configured to process a substrate by using a processing gas; a rotary table that is rotatably provided in the processing chamber; a stage on which the substrate is to be placed and that is configured to be rotatable relative to the rotary table at a position spaced apart from a center of rotation of the rotary table, a lift pin configured to be displaced relative to the stage to raise and lower the substrate; and a housing configured to house the lift pin when the lift pin is not unexposed from the stage. The lift pin and the housing have a closing structure that closes a gap between the lift pin and the housing.

公开(公告)号：US20220293439A1

公开(公告)日：2022-09-15

申请号：US17686764

申请日：2022-03-04

Applicant: Tokyo Electron Limited

Inventor： Yuki WADA ,  Junnosuke TAGUCHI ,  Hisashi TAKAHASHI ,  Manabu HONMA

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/00 ,  F27B17/00 ,  F27D5/00 ,  F28F13/00

Abstract: A substrate processing apparatus includes: a rotary table provided in a processing container; a stage provided on the rotary table to place a substrate thereon, and configured to revolve by a rotation of the rotary table; a heater configured to heat the substrate placed on the stage; and a rotation shaft configured to rotate together with the rotary table and support the stage to be rotatable; and a deflector configured to deflect heating light emitted from the heater toward the rotation shaft.