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公开(公告)号:US20230257877A1
公开(公告)日:2023-08-17
申请号:US18163949
申请日:2023-02-03
Applicant: Tokyo Electron Limited
Inventor: Ibuki HAYASHI , Yasushi TAKEUCHI , Manabu HONMA , Junnosuke TAGUCHI
IPC: C23C16/44 , C23C16/458
CPC classification number: C23C16/4412 , C23C16/4584
Abstract: A substrate processing apparatus includes: a processing chamber; a rotary table rotatably provided inside the processing chamber; a stage that is rotatable relative to the rotary table at a position spaced apart from a rotation center of the rotary table; a process gas supplier provided above the rotary table; a separation gas supplier to supply a separation gas to separation regions, each of the separation regions being adjacent to a processing region; and a gas exhauster including exhaust ports communicating with an inside of the processing chamber, wherein the exhaust ports are provided in the processing region between the separation regions and are provided above the rotary table.
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公开(公告)号:US20240060181A1
公开(公告)日:2024-02-22
申请号:US18363993
申请日:2023-08-02
Applicant: Tokyo Electron Limited
Inventor: Manabu HONMA , Junnosuke TAGUCHI , Yasushi TAKEUCHI
IPC: C23C16/458 , H01L21/687
CPC classification number: C23C16/4581 , H01L21/68764 , H01L21/68771
Abstract: A substrate processing apparatus includes a vacuum chamber, a rotary table in the vacuum chamber, a stage, and a support that supports at least either the rotary table or stage, the support having a thermal expansion coefficient greater than the rotary table or stage that is supported. The rotary table or stage includes a protruding portion protruding toward the support. The support includes a base portion, an insertion portion protruding from a center of the base portion and being inserted into the protruding portion, and an outer edge protruding portion protruding from the base portion. An outer clearance formed between the outer edge protruding portion and the protruding portion is set to be smaller than an inner clearance formed between the insertion portion and the protruding portion at a first temperature, and the outer clearance becomes greater than the inner clearance at a second temperature higher than the first temperature.
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公开(公告)号:US20210214845A1
公开(公告)日:2021-07-15
申请号:US17128655
申请日:2020-12-21
Applicant: Tokyo Electron Limited
Inventor: Junnosuke TAGUCHI
IPC: C23C16/458 , C23C16/455 , H01L21/687
Abstract: A substrate processing apparatus includes a vacuum chamber, a rotary table disposed inside the vacuum chamber and configure to rotate, and a housing box disposed inside the vacuum chamber and configured to rotate together with the rotary table, the housing box having an inside pressure higher than in the vacuum chamber.
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公开(公告)号:US20220130712A1
公开(公告)日:2022-04-28
申请号:US17502615
申请日:2021-10-15
Applicant: Tokyo Electron Limited
Inventor: Junnosuke TAGUCHI
IPC: H01L21/687 , H01L21/67
Abstract: A substrate processing apparatus includes: a rotary table provided inside a processing container; a stage provided on an upper surface of the rotary table in order to mount a substrate thereon, and configured to revolve by a rotation of the rotary table; a heater configured to heat the substrate mounted on the stage; and a rotation shaft provided at a location that rotates together with the rotary table to freely rotate while supporting the stage, and including a low heat conductivity body formed of a material with a heat conductivity lower than that of the stage.
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公开(公告)号:US20210217651A1
公开(公告)日:2021-07-15
申请号:US17128628
申请日:2020-12-21
Applicant: Tokyo Electron Limited
Inventor: Junnosuke TAGUCHI , Nobuhiro TAKAHASHI
IPC: H01L21/687 , H01L21/683
Abstract: A substrate processing apparatus includes a vacuum chamber, a rotary table that is rotatably provided inside the vacuum chamber, a stage that is rotatable with respect to the rotary table, the stage having a center of rotation at a position spaced apart from a center of rotation of the rotary table, and the stage having a flange provided at a lower surface of the stage, a first holder and a second holder, the flange being sandwiched between the first holder and the second holder, and a pressing member configured to press the second holder in a direction in which the second holder comes closer to the first holder.
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公开(公告)号:US20190013225A1
公开(公告)日:2019-01-10
申请号:US16026395
申请日:2018-07-03
Applicant: TOKYO ELECTRON LIMITED
Inventor: Junnosuke TAGUCHI , Yuya SASAKI , Toshiya CHIBA
IPC: H01L21/67 , H01L21/687 , G01N21/95
CPC classification number: H01L21/67288 , G01B11/306 , G01N21/9505 , H01L21/68764 , H01L21/68771
Abstract: A substrate warpage detection device for detecting warpage of a substrate loaded on a substrate loading region having a recess shape formed on a rotary table along a circumferential direction during rotation of the rotary table, includes a light transmitting part configured to transmit a light beam obliquely upward from a side of the rotary table such that a lower portion of the light beam collides with an upper end of a side surface of the rotary table and an upper portion of the light beam positioned more upward than the lower portion of the light beam passes a portion near the surface of the rotary table, and a light receiving part installed to face the light transmitting part and configured to receive the light beam passing the portion near the surface of the rotary table so as to detect an amount of received light.
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公开(公告)号:US20250046646A1
公开(公告)日:2025-02-06
申请号:US18782696
申请日:2024-07-24
Applicant: Tokyo Electron Limited
Inventor: Junnosuke TAGUCHI , Ryotaro TAKAHASHI
IPC: H01L21/687 , H01L21/67
Abstract: A substrate processing apparatus includes a vacuum container, a rotary table provided inside the vacuum container, stages provided along a circumferential direction of the rotary table, and configured to support respective substrates disposed thereon, and a measuring instrument configured to measure characteristics of at least one substrate among the substrates disposed on the stages, wherein the stages are configured to be rotatable relative to the rotary table, wherein the measuring instrument is provided on a circumference of a circle that is centered on a central axis of the rotary table and passes through the stages in a plan view seen from a direction perpendicular to an upper surface of the rotary table.
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公开(公告)号:US20230061423A1
公开(公告)日:2023-03-02
申请号:US17820076
申请日:2022-08-16
Applicant: Tokyo Electron Limited
Inventor: Junnosuke TAGUCHI , Yasutomo KIMURA , Hisashi TAKAHASHI
IPC: H01L21/687 , C23C14/50
Abstract: A substrate processing apparatus includes a processing chamber configured to process a substrate by using a processing gas; a rotary table that is rotatably provided in the processing chamber; a stage on which the substrate is to be placed and that is configured to be rotatable relative to the rotary table at a position spaced apart from a center of rotation of the rotary table, a lift pin configured to be displaced relative to the stage to raise and lower the substrate; and a housing configured to house the lift pin when the lift pin is not unexposed from the stage. The lift pin and the housing have a closing structure that closes a gap between the lift pin and the housing.
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公开(公告)号:US20220293439A1
公开(公告)日:2022-09-15
申请号:US17686764
申请日:2022-03-04
Applicant: Tokyo Electron Limited
Inventor: Yuki WADA , Junnosuke TAGUCHI , Hisashi TAKAHASHI , Manabu HONMA
Abstract: A substrate processing apparatus includes: a rotary table provided in a processing container; a stage provided on the rotary table to place a substrate thereon, and configured to revolve by a rotation of the rotary table; a heater configured to heat the substrate placed on the stage; and a rotation shaft configured to rotate together with the rotary table and support the stage to be rotatable; and a deflector configured to deflect heating light emitted from the heater toward the rotation shaft.
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公开(公告)号:US20250051920A1
公开(公告)日:2025-02-13
申请号:US18788436
申请日:2024-07-30
Applicant: Tokyo Electron Limited
Inventor: Yudai FUKUSHI , Junnosuke TAGUCHI , Yasushi TAKEUCHI , Takehiro FUKADA
IPC: C23C16/458 , C23C16/455 , C23C16/52 , H01L21/67
Abstract: A substrate-processing apparatus includes a process chamber configured to process a plurality of substrates; a rotation table that is disposed in an interior of the process chamber so as to be rotatable and at which the substrates are to be placed at positions that are away in a radial direction of the rotation table from a center of rotation of the rotation table; a supply member configured to supply gas to the substrates placed on the rotation table; and a raising and lowering mechanism configured to raise and lower the supply member relative to the rotation table.
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