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Patent Agency Ranking
公开(公告)号：US20180153034A1
公开(公告)日：2018-05-31
申请号：US15864301
申请日：2018-01-08
Applicant: Toppan Forms Co., Ltd.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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公开(公告)号：US10477679B2
公开(公告)日：2019-11-12
申请号：US15864301
申请日：2018-01-08
Applicant: Toppan Forms Co., Ltd.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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公开(公告)号：US10040960B2
公开(公告)日：2018-08-07
申请号：US14431092
申请日：2013-09-27
Applicant: Toppan Forms Co., LTD.
Inventor： Takuya Sekiguchi , Keiko Omata
Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition. Such a silver ink composition is characterized by being obtained by blending: a silver carboxylate having a group represented by a formula “—COOAg”; one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the above amine compounds or ammonia with an acid; and one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below (in the formula, R21 represents an alkyl group, alkoxy group or N,N-dialkylamino group of not more than 20 carbon atoms, a hydroxyl group or an amino group): or obtained by preparing a second mixture by supplying carbon dioxide to a first mixture formed by mixing a silver carboxylate having a group represented by a formula “—COOAg” and one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the amine compounds or ammonia with an acid; and further mixing one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below to the mixture: H—C(═O)—R21 (5).
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公开(公告)号：US20150259557A1
公开(公告)日：2015-09-17
申请号：US14431092
申请日：2013-09-27
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Takuya Sekiguchi , Keiko Omata
Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition. Such a silver ink composition is characterized by being obtained by blending: a silver carboxylate having a group represented by a formula “—COOAg”; one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the above amine compounds or ammonia with an acid; and one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below (in the formula, R21 represents an alkyl group, alkoxy group or N,N-dialkylamino group of not more than 20 carbon atoms, a hydroxyl group or an amino group): or obtained by preparing a second mixture by supplying carbon dioxide to a first mixture formed by mixing a silver carboxylate having a group represented by a formula “—COOAg” and one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the amine compounds or ammonia with an acid; and further mixing one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below to the mixture: H—C(═O)—R21 (5).
Abstract translation: 提供了一种能够形成具有足够导电性的金属银而不在高温下进行热处理的银墨组合物; 以及使用该银墨组合物获得的导体和通信装置。 这种银墨组合物的特征在于通过以下方式得到：具有由式“-COOAg”表示的基团的羧酸银; 选自胺化合物和不超过25个碳原子的季铵盐的一种或多种含氮化合物，氨和通过使上述胺化合物或氨与酸反应而获得的铵盐; 和选自草酸，肼和下述通式（5）表示的化合物中的一种或多种还原化合物（在式中，R 21表示烷基，烷氧基或未被取代的N，N-二烷基氨基） 大于20个碳原子，羟基或氨基）或通过将二氧化碳供应到通过将具有由式“-COOAg”表示的基团的羧酸银与一种或多种 更多的选自不超过25个碳原子的胺化合物和季铵盐的含氮化合物，氨和通过胺化合物或氨与酸反应而获得的铵盐; 并且将一种或多种选自草酸，肼和下述通式（5）表示的化合物的还原化合物进一步混合到混合物：H-C（= O）-R21（5））中。
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公开(公告)号：US20160330835A1
公开(公告)日：2016-11-10
申请号：US15110977
申请日：2015-01-23
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Abstract translation: 布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小 ，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。
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