公开(公告)号：US20160330835A1

公开(公告)日：2016-11-10

申请号：US15110977

申请日：2015-01-23

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  H05K3/12 ,  G06F3/041 ,  H05K1/02

CPC classification number: H05K1/092 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0225 ,  H05K1/0274 ,  H05K3/1275 ,  H05K2201/032 ,  H05K2201/09681 ,  H05K2201/098

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

Abstract translation: 布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小 ，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。

公开(公告)号：US20180153034A1

公开(公告)日：2018-05-31

申请号：US15864301

申请日：2018-01-08

Applicant: Toppan Forms Co., Ltd.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  H05K1/02 ,  G06F3/044 ,  G06F3/041 ,  H05K3/12

CPC classification number: H05K1/092 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0225 ,  H05K1/0274 ,  H05K3/1275 ,  H05K2201/032 ,  H05K2201/09681 ,  H05K2201/098

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

公开(公告)号：US10477679B2

公开(公告)日：2019-11-12

申请号：US15864301

申请日：2018-01-08

Applicant: Toppan Forms Co., Ltd.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  G06F3/044 ,  H05K1/02 ,  H05K3/12 ,  G06F3/041

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.