公开(公告)号：US20080174976A1

公开(公告)日：2008-07-24

申请号：US11834452

申请日：2007-08-06

申请人： Toshiya SATOH ,  Masahiko OGINO ,  Takao MIWA ,  Takashi NAITOU ,  Takashi NAMEKAWA ,  Toshihide NABATAME ,  Shigehisa MOTOWAKI

发明人： Toshiya SATOH ,  Masahiko OGINO ,  Takao MIWA ,  Takashi NAITOU ,  Takashi NAMEKAWA ,  Toshihide NABATAME ,  Shigehisa MOTOWAKI

IPC分类号： H05K1/18

CPC分类号： H01L27/13 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/49827 ,  H01L27/016 ,  H01L27/0676 ,  H01L27/08 ,  H01L2224/16 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/19011 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09536 ,  H05K2201/09827 ,  H01L2924/00

摘要： Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost.The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

摘要翻译： 通过在基板上安装单个无源元件并增加安装成本来改善模块尺寸增加，提供高可靠性，高性能和小尺寸的电子电路元件，其允许将各种电子部件如 电容器，电感器和电阻器，高密度，低成本。 电子电路部件包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，从夹在电极之间的电介质材料的电容器元件中选择的一个或多个元件，电感器元件和电阻元件，连接 所述元件，所述金属布线的一部分的金属端子部分和覆盖所述元件的有机绝缘体材料以及除了所述金属端子部分之外的所述金属布线部分的周边。