Semiconductor device and method of manufacturing such a semiconductor device
    1.
    发明申请
    Semiconductor device and method of manufacturing such a semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US20040014274A1

    公开(公告)日:2004-01-22

    申请号:US10462846

    申请日:2003-06-16

    Abstract: A semiconductor device comprises a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory cell comprising a source (3) and a drain (4), and an access gate (14) which is electrically insulated from a gate structure (8) comprising a control gate (9), the gate structure (8) being electrically insulated from the semiconductor body (1) by a gate dielectric (11,25). The gate dielectric (11,25) is provided with a charge-storage region wherein data in the form of electric charge can be stored. The access gate (14) has a substantially flat surface portion (17) extending substantially parallel to the surface (2) of the semiconductor body (1) and has the shape of a block which is disposed against the gate structure (8) without overlapping the gate structure (8).

    Abstract translation: 半导体器件包括半导体本体(1),其在表面(2)处设置有包括源极(3)和漏极(4)的非易失性存储单元,以及存取栅极(14),其电绝缘 从包括控制栅极(9)的栅极结构(8),栅极结构(8)通过栅极电介质(11,25)与半导体本体(1)电绝缘。 栅极电介质(11,25)设置有电荷存储区域,其中可以存储电荷形式的数据。 进入门(14)具有基本上平行于半导体本体(1)的表面(2)延伸的基本平坦的表面部分(17),并且具有块状形状,该块形状抵靠栅极结构(8)而不重叠 门结构(8)。

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