公开(公告)号：US09783408B2

公开(公告)日：2017-10-10

申请号：US14307512

申请日：2014-06-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Bang-Chiang Lan ,  Ming-I Wang ,  Li-Hsun Ho ,  Hui-Min Wu ,  Min Chen ,  Chien-Hsin Huang

IPC: H04R7/00 ,  B81B3/00 ,  H04R19/00 ,  H04R31/00 ,  H04R3/00

CPC classification number: B81B3/0021 ,  B81B2201/0271 ,  H04R3/00 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R2499/11 ,  Y10T29/49002

Abstract: A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.

公开(公告)号：US20140291787A1

公开(公告)日：2014-10-02

申请号：US14307512

申请日：2014-06-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Bang-Chiang Lan ,  Ming-I Wang ,  Li-Hsun Ho ,  Hui-Min Wu ,  Min Chen ,  Chien-Hsin Huang

IPC: B81B3/00 ,  H04R3/00 ,  H04R7/00

CPC classification number: B81B3/0021 ,  B81B2201/0271 ,  H04R3/00 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R2499/11 ,  Y10T29/49002

Abstract: A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.

Abstract translation: 公开了一种微电子机械系统（MEMS）电声换能器的结构。 MEMS电声换能器包括具有MEMS器件区域的基板，具有开口且设置在MEMS器件区域中的隔膜，设置在隔膜上并密封隔膜的硅材料层，以及设置在MEMS器件的隔膜下方的导电图案 地区。 优选地，在隔膜和基板之间也形成第一空腔。