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公开(公告)号：US20220262749A1
公开(公告)日：2022-08-18
申请号：US17160400
申请日：2021-01-28
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Aaron Chen , CHI REN , YI HSIN LIU
IPC: H01L23/00 , H01L23/522
Abstract: An integrated circuit structure includes a substrate with a circuit region thereon and a copper interconnect structure disposed on the substrate. The copper interconnect structure includes an uppermost copper layer covered by a dielectric layer. An aluminum pad layer is provided on the dielectric layer. A metal layer is provided on the circuit region and is located between the uppermost copper layer and the aluminum pad layer.
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