公开(公告)号：US20230178413A1

公开(公告)日：2023-06-08

申请号：US18072730

申请日：2022-12-01

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd SHARIFF ,  IL KWON SHIM ,  Enrique E. SARILE, JR. ,  Jackson Fernandez ROSARIO ,  Ronnie M. DE VILLA ,  Chan Loong NEO

IPC: H01L21/683 ,  H01L21/78 ,  B23K26/38 ,  H01L21/3065

CPC classification number: H01L21/6836 ,  B23K26/38 ,  H01L21/78 ,  H01L21/3065 ,  H01L2221/68327

Abstract: Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combination of plama dicing and laser cutting is employed. Plasma is employed to etch the wafer while laser is employed to cut the DAF.