公开(公告)号：US20230178413A1

公开(公告)日：2023-06-08

申请号：US18072730

申请日：2022-12-01

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd SHARIFF ,  IL KWON SHIM ,  Enrique E. SARILE, JR. ,  Jackson Fernandez ROSARIO ,  Ronnie M. DE VILLA ,  Chan Loong NEO

IPC: H01L21/683 ,  H01L21/78 ,  B23K26/38 ,  H01L21/3065

CPC classification number: H01L21/6836 ,  B23K26/38 ,  H01L21/78 ,  H01L21/3065 ,  H01L2221/68327

Abstract: Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combination of plama dicing and laser cutting is employed. Plasma is employed to etch the wafer while laser is employed to cut the DAF.

公开(公告)号：US20250038037A1

公开(公告)日：2025-01-30

申请号：US18393621

申请日：2023-12-21

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL KWON SHIM ,  Dzafir Bin Mohd Shariff ,  Ronnie M. De Villa ,  Enrique E. SARILE, JR. ,  Chee Kay Chow ,  Jackson Fernandez Rosario ,  Chan Loong Neo

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Lamination systems and methods of fabricating devices are disclosed. The lamination system includes multiple processing modules for delaminating a backgrinding (BG) from a surface of the wafer and laminating a dicing tape on the surface of the wafer. The system includes a wafer receiving module which is configured to hold the wafer in place with a position chuck throughout the delamination and lamination process. By using a single positioning chuck, more efficient processing is achieved. For example, there is no need to re-lign the wafer when it is moved from one chuck to another.