公开(公告)号：US20210273356A1

公开(公告)日：2021-09-02

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang TSENG ,  Pei-Wei WANG ,  Ching-Ho HSIEH ,  Shao-Chien LEE ,  Kuo-Wei LI

IPC: H01R12/62 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US20220240367A1

公开(公告)日：2022-07-28

申请号：US17198287

申请日：2021-03-11

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao WU ,  Kuo-Wei LI

IPC: H05K1/02 ,  H05K3/28 ,  B01J13/18 ,  B01J13/20 ,  C09D11/10

Abstract: A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.