公开(公告)号：US10461200B1

公开(公告)日：2019-10-29

申请号：US16054938

申请日：2018-08-03

Applicant: United Microelectronics Corp.

Inventor： Wen-Chieh Wang ,  Chuan-Sheng Liu ,  Bo-Cheng Chen

IPC: H01L27/14 ,  H01L31/0216 ,  F21V8/00 ,  H01L31/0232 ,  H01L31/18 ,  G03F7/00

Abstract: A semiconductor structure including a substrate, a light sensing device and a light-guiding structure is provided. The light sensing device is disposed in the substrate. The light-guiding structure is located above the light sensing device. The light-guiding structure has a top surface and a bottom surface opposite to each other, and the bottom surface is closer to the substrate than the top surface. A position of a minimum width of the light-guiding structure is located between the top surface and the bottom surface.