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公开(公告)号:US20250149359A1
公开(公告)日:2025-05-08
申请号:US18395777
申请日:2023-12-26
Applicant: United Microelectronics Corp.
Inventor: Chih-Chung KUO , Yung-Chieh KUO , Cheng-Tai PENG , Min-Wei TSAI , Sheng- Ming WANG , Jui-Hung LEE , Ke-Wei WEI , Ping-Yi LU , Shi-Hao WANG , Chih-Hsiang HSIAO
IPC: H01L21/67
Abstract: A controlling method for semiconductor process auxiliary apparatus, a control assembly and a manufacturing system are provided. The controlling method includes the following steps. At least one manufacturing parameter of a semiconductor manufacturing processing apparatus are obtained. An energy adjusting signal is generated according to the manufacturing parameter. An auxiliary apparatus controlling signal is generated according to the energy adjusting signal. The semiconductor process auxiliary apparatus is controlled according to the semiconductor auxiliary apparatus controlling signal.
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公开(公告)号:US20220283217A1
公开(公告)日:2022-09-08
申请号:US17226460
申请日:2021-04-09
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ji-Fu KUNG , Yi-Lin HUNG , Chih-Chung KUO , Wei-Che LIN
IPC: G01R31/26
Abstract: An equipment sensing circuit board and an operation method thereof are provided. The equipment sensing circuit board equipped on a semiconductor equipment includes a main sensor, a backup sensor, a first electronic fuse, a second electronic fuse, and a multiplexer. The main sensor and the backup sensor are used to monitor the operation of the semiconductor equipment to output a main sensing signal and a backup sensing signal respectively. The first electronic fuse is disposed on the main sensor to output a first status signal. The second electronic fuse is disposed on the backup sensor to output a second status signal. The multiplexer is connected to the main sensor, the backup sensor, the first electronic fuse and the second electronic fuse. The multiplexer selects to output the main sensing signal or the backup sensing signal according to the combination of the first state signal and the second state signal.
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公开(公告)号:US20240094094A1
公开(公告)日:2024-03-21
申请号:US17983423
申请日:2022-11-09
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Wei-Chen WU , Cheng-Tai PENG , Chih-Chung KUO
CPC classification number: G01M99/005 , G01H13/00 , G06N20/00
Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.
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