公开(公告)号：US20200251655A1

公开(公告)日：2020-08-06

申请号：US16778200

申请日：2020-01-31

Applicant: Universal Display Corporation

Inventor： Gregory MCGRAW ,  William E. QUINN ,  Steven BUSWELL

IPC: H01L51/00 ,  H01L51/56 ,  B05B1/02 ,  C23C14/12 ,  C23C14/22 ,  C23C14/04 ,  C23C16/44 ,  C23C16/455

Abstract: Embodiments of the disclosed subject matter provide a device including a carrier plate, and a die including a mating surface with a patterned thin film of metal or metal oxide surface bonded to the carrier plate using a solder preform with voids that overlay the patterned thin film on the die, where the oxide surface is disposed opposite a moat in a mating surface of the carrier plate, and where the voided regions remain free of solder when the solder is reflowed.