公开(公告)号：US11206732B2

公开(公告)日：2021-12-21

申请号：US16460963

申请日：2019-07-02

Applicant: Waymo LLC

Inventor： Matthew Last ,  Unique Rahangdale ,  Giulia Guidi ,  Roya Mirhosseini-Schubert

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/10 ,  H05K1/18

Abstract: The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

公开(公告)号：US20210007216A1

公开(公告)日：2021-01-07

申请号：US16460963

申请日：2019-07-02

Applicant: Waymo LLC

Inventor： Matthew Last ,  Unique Rahangdale ,  Giulia Guidi ,  Roya Mirhosseini-Schubert

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/10 ,  H05K1/18

Abstract: The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.