公开(公告)号：US20230199941A1

公开(公告)日：2023-06-22

申请号：US17557877

申请日：2021-12-21

Applicant: XILINX, INC.

Inventor： Shad SHEPSTON ,  Robert Andrew DANIELS

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H05K1/114 ,  H05K1/0219 ,  H05K1/181

Abstract: Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

公开(公告)号：US20230284384A1

公开(公告)日：2023-09-07

申请号：US17687548

申请日：2022-03-04

Applicant: XILINX, INC.

Inventor： Ieuan James Mackereth MARSHALL ,  Robert Andrew DANIELS

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/14 ,  H05K1/0274 ,  H05K2201/1034 ,  H05K2201/0397 ,  H05K2201/10325

Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.