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公开(公告)号：US09936580B1
公开(公告)日：2018-04-03
申请号：US14596914
申请日：2015-01-14
Applicant: VLT, Inc.
CPC classification number: B23K1/20 , B23K1/0016 , B23K2001/12 , H05K1/0209 , H05K3/284 , H05K7/20409 , H05K2201/10166 , H05K2201/1034 , H05K2203/1316
Abstract: Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.
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公开(公告)号：US09930796B2
公开(公告)日：2018-03-27
申请号：US15124602
申请日：2015-03-13
Applicant: TEXA S.p.A.
Inventor： Mauro Fantin , Igor Martinelli
IPC: H05K1/14 , H05K5/02 , H01R12/57 , H01R12/58 , H01R13/66 , G07C5/02 , G07C5/08 , H05K1/18 , H05K5/00 , H05K1/11
CPC classification number: H05K5/0247 , G07C5/02 , G07C5/08 , H01R12/57 , H01R12/58 , H01R13/665 , H01R13/6658 , H01R2201/26 , H05K1/117 , H05K1/181 , H05K5/0069 , H05K2201/09181 , H05K2201/1034 , H05K2201/10545
Abstract: Vehicle diagnostic interface module comprising: a printed circuit board, an OBD connector, which is provided with a plate-like contact-carrier socket arranged parallel to and facing the printed circuit board, a plurality of rigid pins, each of them having a first segment projecting from the inner face of the socket along an axis orthogonal to the printed circuit board and inserted in a notch formed on the outer perimeter edge of the board.
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公开(公告)号：US09905973B2
公开(公告)日：2018-02-27
申请号：US14949958
申请日：2015-11-24
Applicant: CommScope, Inc. of North Carolina
Inventor： Richard A. Schumacher
IPC: H01R13/6473 , H01R13/6461 , H01R24/62 , H01R13/6466 , H05K1/16 , H01R24/64 , H05K1/02 , H05K1/11
CPC classification number: H01R13/6473 , H01R13/6466 , H01R24/64 , H05K1/0219 , H05K1/0228 , H05K1/024 , H05K1/0245 , H05K1/025 , H05K1/117 , H05K1/165 , H05K2201/0187 , H05K2201/0191 , H05K2201/09672 , H05K2201/09727 , H05K2201/09781 , H05K2201/1034 , H05K2201/10356
Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.
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公开(公告)号：US09835303B2
公开(公告)日：2017-12-05
申请号：US14654538
申请日：2013-12-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Siegfried Herrmann , Walter Wegleiter , Andreas Plöβl
CPC classification number: H05K3/32 , F21S41/141 , F21S41/192 , F21S43/14 , F21S43/195 , H01L25/0753 , H01L33/0079 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H05K3/325 , H05K2201/10106 , H05K2201/1034 , H05K2201/10409 , H05K2201/10924 , Y10T29/49131 , H01L2924/00
Abstract: An optoelectronic device and a method for producing an optoelectronic device are disclosed. An embodiment of an optoelectronic device includes a carrier, an electrically conductive layer arranged on the carrier, at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer. The device further comprises a holder, wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder, wherein the carrier is mechanically connected with the holder by at least one fastening element and is fastened to the holder, wherein the fastening element passes completely through the carrier, and wherein the semiconductor chip is electrically conductively connected to the holder by the fastening element.
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公开(公告)号：US09831573B2
公开(公告)日：2017-11-28
申请号：US14300855
申请日：2014-06-10
Applicant: Apple Inc.
Inventor： Emery A. Sanford , Tyson B. Manullang , David G. Havskjold , Tyler S. Bushnell , Eric S. Jol , Anthony S. Montevirgen , John Raff
CPC classification number: H01R12/62 , H01R12/52 , H05K1/14 , H05K1/142 , H05K1/147 , H05K1/148 , H05K2201/046 , H05K2201/05 , H05K2201/10325 , H05K2201/1034 , H05K2201/10681
Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
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Patent Agency Ranking
公开(公告)号：US20170318663A1
公开(公告)日：2017-11-02
申请号：US15470014
申请日：2017-03-27
Applicant: Yazaki Corporation
Inventor： Hiroki Kondo , Makoto Kambe , Shota Sato , Yukito Aoyama , Hisashi Takemoto
CPC classification number: H05K1/0213 , H05K1/0263 , H05K1/05 , H05K1/092 , H05K1/18 , H05K3/22 , H05K2201/09845 , H05K2201/10272 , H05K2201/1034 , H05K2201/10416
Abstract: A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.
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公开(公告)号：US20170094818A1
公开(公告)日：2017-03-30
申请号：US15272960
申请日：2016-09-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeon-Woo KIM , Jeong WOO , Jung-Sik PARK
CPC classification number: H05K5/0047 , G06F1/1626 , G06F1/1698 , H01R12/57 , H01R13/2407 , H01R2101/00 , H01R2201/02 , H04M1/0277 , H05K1/0213 , H05K1/11 , H05K5/0017 , H05K2201/0311 , H05K2201/1034 , H05K2201/10409
Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface directed in the first direction, a second surface directed in a second direction opposite to the first direction, and a lateral side that surrounds, at least in part, a space formed between the first surface and the second surface, a display, an antenna radiating body, a printed circuit board including a first hole and a metal member positioned in the first hole, a flexible connecting member disposed between a portion of the antenna radiating body and a portion of the metal member, a conductive plate configured for contacting the connecting member, or being formed by a portion of the connecting member to include a second hole, and a coupling member for coupling the conductive plate to the printed circuit board by passing through the second hole and contacting with the metal member.
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公开(公告)号：US20170020011A1
公开(公告)日：2017-01-19
申请号：US15124602
申请日：2015-03-13
Applicant: TEXA S.p.A.
Inventor： Mauro Fantin , Igor Martinelli
CPC classification number: H05K5/0247 , G07C5/02 , G07C5/08 , H01R12/57 , H01R12/58 , H01R13/665 , H01R13/6658 , H01R2201/26 , H05K1/117 , H05K1/181 , H05K5/0069 , H05K2201/09181 , H05K2201/1034 , H05K2201/10545
Abstract: Vehicle diagnostic interface module comprising: a printed circuit board, an OBD connector, which is provided with a plate-like contact-carrier socket arranged parallel to and facing the printed circuit board, a plurality of rigid pins, each of them having a first segment projecting from the inner face of the socket along an axis orthogonal to the printed circuit board and inserted in a notch formed on the outer perimeter edge of the board.
Abstract translation: 车辆诊断接口模块包括：印刷电路板，OBD连接器，其设置有平行于并面向印刷电路板的板状接触承载座，多个刚性销，每个具有第一段 从插座的内表面沿着与印刷电路板正交的轴突出并插入形成在板的外周边缘上的凹口中。
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公开(公告)号：US20170019997A1
公开(公告)日：2017-01-19
申请号：US14962783
申请日：2015-12-08
Applicant: L-3 Communications Corporation
Inventor： Brent A. BOUDREAUX
CPC classification number: H01P3/003 , H01R12/737 , H05K1/117 , H05K1/14 , H05K1/141 , H05K3/366 , H05K5/0291 , H05K2201/0311 , H05K2201/1034
Abstract: An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.
Abstract translation: 提供电子组件和装置。 电子组件包括第一电路板，其中PCB焊盘位于电路板的边缘附近，以及相应的多个触点，每个触点焊接到PCB焊盘之一。 每个触点具有焊接到PCB焊盘的第一部分和延伸经过电路板的边缘并形成板簧的第二部分。 当与第二电路板的PCB焊盘接触时，板簧压缩，其中PCB焊盘与第二电路板的表面基本上共面。 第二部分的恢复力保持第二电路板的第二部分和PCB焊盘之间的接触。 触点在第一电路板的PCB焊盘和第二电路板的PCB焊盘之间形成电连接。
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公开(公告)号：US09484290B2
公开(公告)日：2016-11-01
申请号：US13969604
申请日：2013-08-18
Applicant: CYNTEC CO., LTD.
Inventor： Han-Hsiang Lee , Jeng-Jen Li , Kun-Hong Shih
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/49531 , H01L23/49541 , H01L2224/49175 , H02M3/00 , H05K1/021 , H05K3/0061 , H05K7/1432 , H05K2201/1034 , H05K2201/10924 , H05K2203/1327
Abstract: A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.
Abstract translation: 由安装在引线框架上的导电图案结构制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，并且相对低的热产生的电子部件适于安装在导电图案结构上。 金属线用于IC芯片的电路与导电图案结构之间的电耦合。 具有复合衬底的电子系统获得了两个优点 - 来自导电图案结构的良好的电路布置能力和来自引线框架的良好热分布。
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