公开(公告)号：US20210366873A1

公开(公告)日：2021-11-25

申请号：US16880811

申请日：2020-05-21

Applicant: XILINX, INC.

Inventor： Jaspreet Singh GANDHI ,  Suresh RAMALINGAM ,  William E. ALLAIRE ,  Hong SHI ,  Kerry M. PIERCE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.