公开(公告)号：US09190362B2

公开(公告)日：2015-11-17

申请号：US14325812

申请日：2014-07-08

Applicant: XINTEC INC.

Inventor： Wen-Cheng Chien ,  Wen-Ken Huang ,  Chien-Hung Liu ,  Joey Lai

IPC: H01L21/00 ,  H01L23/00 ,  H01L27/146

CPC classification number: H01L23/562 ,  H01L24/05 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/02235 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.

Abstract translation: 本发明提供一种芯片封装及其制造方法。 在一个实施例中，芯片封装包括：衬底，其上具有半导体器件和导电焊盘; 填充形成在所述衬底中的沟槽的绝缘体环，其中所述绝缘体环围绕所述导电焊盘下方的中间层; 以及设置在所述基板的背面下方并与导电焊盘电连接的导电层。