公开(公告)号：US20150222033A1

公开(公告)日：2015-08-06

申请号：US14174697

申请日：2014-02-06

Applicant: Xilinx, Inc.

Inventor： Paul Y. Wu ,  Sarajuddin Niazi ,  Raymond E. Anderson ,  Suresh Ramlingam

IPC: H01R12/71 ,  H01R43/02

CPC classification number: H01R12/71 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5386 ,  H01L2224/16 ,  H01L2924/0002 ,  H01R43/0235 ,  Y10T29/49117 ,  H01L2924/00

Abstract: An apparatus for placement between a package and an integrated circuit board includes: an insert having: a substrate having a top side and a bottom side; a first set of pads at the top side of the substrate; a second set of pads at the bottom side of the substrate; and a plurality of vias in the substrate, the vias connecting respective pads in the first set to respective pads in the second set; wherein the insert has a thickness that is less than a spacing between the package and the integrated circuit board.

Abstract translation: 用于放置在封装和集成电路板之间的装置包括：插入件，其具有：具有顶侧和底侧的基板; 在衬底的顶侧的第一组衬垫; 在衬底的底侧的第二组衬垫; 以及衬底中的多个通孔，将第一组中的各个焊盘连接到第二组中的相应焊盘的通孔; 其中插入件的厚度小于封装和集成电路板之间的间隔。