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1.发明申请公开(公告)号：US20080193728A1
公开(公告)日：2008-08-14
申请号：US12051715
申请日：2008-03-19
IPC分类号： B32B15/095 , B05D3/06 , B32B33/00 , B65B33/00
CPC分类号： B32B27/08 , B32B27/30 , B32B27/40 , C08G2170/40 , C09J7/29 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , Y10T428/2495 , Y10T428/2848 , Y10T428/31551
摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。
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2.发明申请公开(公告)号：US20050153129A1
公开(公告)日：2005-07-14
申请号：US11038147
申请日：2005-01-21
CPC分类号： B32B27/08 , B32B7/12 , B32B2307/748 , B32B2405/00 , C09J7/29 , C09J2201/162 , C09J2433/006 , C09J2475/006 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , Y10T428/28 , Y10T428/2848
摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。
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3.发明授权Cleaning sheet and its production method as well as transporting member having such cleaning sheet 有权清洁片及其制造方法以及具有该清洁片的搬送构件公开(公告)号：US07712177B2
公开(公告)日：2010-05-11
申请号：US10802883
申请日：2004-03-18
申请人： Yoshinori Yoshida , Yohei Maeno , Jirou Nukaga
发明人： Yoshinori Yoshida , Yohei Maeno , Jirou Nukaga
CPC分类号： B08B7/0014 , Y10T428/24843
摘要： To provide a cleaning sheet that can remove foreign matter adhering on a probe needle without wearing the probe needle and that does not allow the foreign matter to re-adhere on the probe needle, the cleaning sheet has a cleaning layer on at least one surface thereof, the cleaning layer containing a urethane polymer and a vinyl monomer.
摘要翻译： 为了提供清洁片，其可以在不磨损探针的情况下去除附着在探针上的异物，并且不允许异物重新附着在探针上，清洁片在其至少一个表面上具有清洁层 ，所述清洁层含有聚氨酯聚合物和乙烯基单体。
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