公开(公告)号：US20080193728A1

公开(公告)日：2008-08-14

申请号：US12051715

申请日：2008-03-19

申请人： Yoshinori YOSHIDA ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

发明人： Yoshinori YOSHIDA ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

IPC分类号： B32B15/095 ,  B05D3/06 ,  B32B33/00 ,  B65B33/00

CPC分类号： B32B27/08 ,  B32B27/30 ,  B32B27/40 ,  C08G2170/40 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6839 ,  Y10T428/2495 ,  Y10T428/2848 ,  Y10T428/31551

摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

公开(公告)号：US20050153129A1

公开(公告)日：2005-07-14

申请号：US11038147

申请日：2005-01-21

申请人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

发明人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

IPC分类号： B32B27/08 ,  C09J7/02 ,  H01L21/68 ,  B32B9/00 ,  B32B33/00 ,  B32B7/12 ,  B32B15/04

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/29 ,  C09J2201/162 ,  C09J2433/006 ,  C09J2475/006 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6839 ,  Y10T428/28 ,  Y10T428/2848

摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

公开(公告)号：US07514143B2

公开(公告)日：2009-04-07

申请号：US10912615

申请日：2004-08-05

申请人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

发明人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

IPC分类号： B32B7/12 ,  B05D5/10

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  Y10T156/1052 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2848

摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C.

摘要翻译： 本发明的可再剥离粘合片是一种可再剥离的压敏粘合片，其包括在基膜上形成的粘合层，并且还包括在基膜和粘合剂之间的至少一个中间层 层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4〜1.0×10 8 Pa，在200℃下的储能弹性模量（G'）为1.0×10 3〜8.0×10 4 Pa。

公开(公告)号：US20050031861A1

公开(公告)日：2005-02-10

申请号：US10912615

申请日：2004-08-05

申请人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

发明人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

IPC分类号： B32B7/12 ,  C09J7/02 ,  C09J9/00 ,  C09J133/00 ,  C09J201/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  Y10T156/1052 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2848

摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.

摘要翻译： 本发明的可再剥离粘合片是可再剥离的粘合片，其包含在基膜上形成的粘合剂层，并且还包括在基膜和 粘合剂层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4至1​​.0×10 8 Pa，储存弹性模量（G'）为1.0×10 3至 在200℃下为8.0×10 4 Pa。即使这种可再剥离粘合片和半导体晶片彼此粘合并且它们被放置在加热环境中，也可以防止晶片 从扭曲。

公开(公告)号：US20060257651A1

公开(公告)日：2006-11-16

申请号：US11383371

申请日：2006-05-15

申请人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

发明人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

IPC分类号： B32B7/12

CPC分类号： H01L21/6836 ,  B32B7/12 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891

摘要： According to the invention, a pressure-sensitive adhesive sheet for use in dicing of a workpiece is provided which comprises a base film and at least a pressure-sensitive adhesive layer provided on the base film, wherein the pressure-sensitive adhesive layer comprises an acrylic polymer that contains at least 5% by weight of a monomer unit having an alkoxyl group in its side chain. According to the structure, there are provided a pressure-sensitive adhesive sheet for dicing that can produce good pickup performance even after a long time and a method of picking up a product worked with the pressure-sensitive adhesive sheet.

摘要翻译： 根据本发明，提供了一种用于切割工件的压敏粘合片，其包括基膜和至少设置在基膜上的压敏粘合剂层，其中压敏粘合剂层包含丙烯酸 在侧链中含有至少5重量％的具有烷氧基的单体单元的聚合物。 根据该结构，提供了即使经过长时间也能够获得良好的拾取性能的切割用粘合片，以及拾取用压敏粘合片加工的产品的方法。

公开(公告)号：US20060188725A1

公开(公告)日：2006-08-24

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B37/00

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US20070059903A1

公开(公告)日：2007-03-15

申请号：US11514504

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： H01L21/6835 ,  B24B37/30 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/003 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层 在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物， 以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜 在23℃下为0.6GPa以上。

公开(公告)号：US20070054469A1

公开(公告)日：2007-03-08

申请号：US11514454

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006

摘要： To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合片，该压敏粘合片依次具有基底，中间层和压敏粘合剂层，其中中间层 在23℃下的拉伸弹性模量为10MPa以上至100Mpa以下，中间层包含通过聚合含有70〜99重量份的（甲基）丙烯酸酯的混合物而得到的丙烯酸系聚合物 单体和1〜30重量份的不饱和羧酸，基于100重量份的总单体，并且所述基材包括至少一种在23℃下的拉伸弹性模量为0.6GPa以上的膜。

公开(公告)号：US20070071969A1

公开(公告)日：2007-03-29

申请号：US11524177

申请日：2006-09-20

申请人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

发明人： Tomohiro Kontani ,  Kouji Akazawa ,  Kohei Yano ,  Yoshinori Yoshida

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/4854 ,  C08G18/6229 ,  C08G18/7642 ,  C08G18/8116 ,  C08G2170/40 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2848

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.

摘要翻译： 为了提供在处理期间用于加工诸如半导体晶片的制品的压敏粘合剂，其不会引起污染或不会破坏半导体晶片，所以压敏粘合片具有基底，中间层和压力 敏感粘合剂层。 中间层包括含有丙烯酸类聚合物和乙烯基类聚合物作为活性成分的复合膜。 氨基甲酸酯聚合物的含量在10％以下的差示分子量曲线中含有重均分子量为10,000以下的成分。

公开(公告)号：US20070036930A1

公开(公告)日：2007-02-15

申请号：US11500118

申请日：2006-08-07

申请人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

发明人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

IPC分类号： B32B33/00

CPC分类号： B32B7/12 ,  B32B7/06 ,  B32B27/08 ,  B32B27/308 ,  B32B2309/105 ,  B32B2405/00 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/14

摘要： To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tanδ) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more

摘要翻译： 为了提供用于处理晶片等物品的压敏粘合片，即使当凹凸的高度差大时，也可以产生较少的压敏粘合片的切割污泥，并且可以跟随晶片的不均匀性 所述粘合片具有在其一个表面上具有中间层和压敏粘合剂层的基体，其中所述中间层的初始弹性模量为0.5N / mm 2以下， 或更少，在20℃至70℃的损耗角正切（tandelta）为0.4或更大，凝胶分数为30％或更多